An inductor includes a support having first and second coils formed on first and second surfaces thereof, respectively; a body embedding the support therein so that end portions of the first and second coils are exposed through first and second surfaces of the body opposing each other, and including a first magnetic part disposed in cores of the first and second coils and on upper and lower surfaces of the first and second coils, respectively, and second magnetic parts disposed on upper and lower surfaces of the first magnetic part, respectively; and first and second external electrodes formed on outer surfaces of the body to be electrically connected to the end portions of the first and second coils, respectively. The second magnetic part has a content of a hardening accelerator greater than that of the first magnetic part.

A body of an inductor component includes a magnetic layer, a first insulating resin, a second insulating resin, and an insulating layer. First inductor wiring extends along a principal surface of the body, inside the magnetic layer. First vertical wiring is connected to an upper surface of a first pad of the first inductor wiring. An upper surface of the first vertical wiring is exposed without being obstructed by the principal surface. A first outer terminal is connected to the upper surface of the first vertical wiring and protrudes from the principal surface upward in a thickness direction. The first outer terminal includes a metal layer covering the upper surface of the first vertical wiring and a solder portion on an upper surface of the metal layer. An upper portion including a protruding distal end of the first outer terminal is the solder portion made of a tin alloy.

In a multilayer coil component, a multilayer body includes a plurality of insulator layers and a through-hole. The through-hole penetrates in a third positive direction. A first coil extends inside the multilayer body while surrounding an outer circumference of the through-hole. A magnetic resin is filled into the through-hole. An overlying adhesive resin layer is laminated on a first surface of the multilayer body. An upper magnetic substrate is adhered to the multilayer body with the overlying adhesive resin layer interposed therebetween. The overlying adhesive resin layer includes an accommodation space. The accommodation space is connected to the through-hole. When the multilayer coil component is seen in the third positive direction, an outer edge of the accommodation space is located on an outer side of an outer edge of the through-hole. A portion of the magnetic resin is located inside the accommodation space.

Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.

The present application provides a coil for facilitating an electromagnetic coupling and method for increasing the degree of an electromagnetic coupling. The coil for facilitating an electromagnetic coupling includes one or more loops formed from a material through which an electric current can flow. At least one of the one or more loops is adjustable, including at least one of a size and a shape of the at least one of the one or more loops of the coil being selectively adjustable.

An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.

A coil component includes a main body made of a magnetic material, a linear inductor wiring conductor arranged in the main body, an electrically insulating pedestal having a top surface extending along the inductor wiring conductor in the main body and a pair of side surfaces each extending from both outer edges of the top surface in a direction intersecting the top surface, and a conductive seed layer provided over an entire region of at least a region sandwiched between the top surface of the pedestal and the inductor wiring conductor. When a width dimension of a surface of the inductor wiring conductor in contact with the seed layer is defined as a first width dimension and a width dimension of the seed layer is defined as a second width dimension, the second width dimension is larger than the first width dimension.