A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric (IMD) layer, and first and second winding portions symmetrically arranged in the IMD layer and the insulating redistribution layer with respect to a symmetrical axis. The first and second winding portions each includes at least first and second semi-circular stacking layers arranged from the inside to the outside and in concentricity. The first and second semi-circular stacking layers each has a first trace layer in the insulating redistribution layer and a second trace layer in the IMD layer and correspondingly formed below the first trace layer. A first slit opening passes through the second trace layer and extends in the extending direction of the length of the second trace layer.

An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.

A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.

An inductor device including a first ring-type structure, a second ring-type structure, and a third ring-type structure is disclosed. The second ring-type structure is coupled to the first ring-type structure and formed an 8-shaped loop with the first ring-type structure. The third ring-type structure is coupled to the second ring-type structure. The first ring-type structure and the second ring-type structure are located at an area surrounded by the third ring-type structure.

An inductor device includes a first coil, a second coil and a toroidal coil. The first coil is partially overlapped with the second coil in a vertical direction. The toroidal coil is disposed outside the first coil and the second coil. The first coil is interlaced with the second coil at a first side and a second side of the inductor device.

A common mode choke coil includes an element body of laminated insulating layers; electrically insulated first and second coils in the element body; first and second outer electrodes on the element body electrically connected to ends of the first coil; and third and fourth outer electrodes on the element body electrically connected to ends of the second coil. The first coil includes first to third coil conductors on first to third insulating layers. The second coil includes fourth to sixth coil conductor on fourth to sixth insulating layers. The second and third coil conductors are electrically connected via a via conductor overlapping at outer ends of the conductors. A dummy conductor overlapping the via conductor is provided on at least one of the first, fourth, fifth, and sixth insulating layers other than between the second and third insulating layers and electrically insulated from all the coil conductors.

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.

The present invention discloses an inductor apparatus. Each of a first section of a second and a fourth quadrant loops are bridged to a first section of a former quadrant loop and are bridged to a third section to a second section of a diagonal quadrant loop. Each of a second section of the second and the fourth quadrant loops are coupled to a third section of the diagonal quadrant loop, and to the second section of a former quadrant loop. A first section of a third quadrant loop is coupled to a first section of the fourth quadrant loop, and to a third section of the first quadrant loop. The second section of the third quadrant loop is coupled to a second section of the fourth quadrant loop and to a third section of the third quadrant loop, and to a third section of the first quadrant loop.

A transformer device includes first conductive segments, second segments, and third conductive segments. The second segments include second conductive segments and first bridging segments. The first bridging segments are connected to the first conductive segments to form a first inductor. The third conductive segments include second bridging segments, and the third conductive segments are connected to the second conductive segments to form a second inductor. The first inductor is located on the second inductor. The first bridging segments and the first conductive segments form first interlaced portions along a first direction. The second bridging segments and the second conductive segments form second interlaced portions along a second direction. The first direction is different from the second direction.