In an embodiment, an integrated circuit die includes a semiconductor substrate, patterned metal layers compiled over the semiconductor substrate, and a tapered multipath inductor formed in the patterned metal layers. The tapered multipath inductor includes, in turn, an inductor input terminal, an inductor output terminal, and N number of parallel inductor tracks electrically coupled between the inductor input terminal and the inductor output terminal. The parallel inductor tracks wind or wrap around an inductor centerline to define a plurality of multipath inductor windings including an innermost winding and an outermost winding. The parallel inductor tracks further vary in track width when progressing from the outermost winding to the innermost winding of the plurality of multipath inductor windings.

An inductor device includes a first wire and a second wire. The first wire includes a first sub-wire and a second sub-wire. The first sub-wire is disposed in a first area. The second sub-wire is disposed in a second area, and the first sub-wire and the second sub-wire are located on different layers. The second wire includes a third sub-wire and a fourth sub-wire. The third sub-wire is disposed in the second area, and located below the second sub-wire. The fourth sub-wire is disposed in the first area, the third sub-wire and the fourth sub-wire are located on different layers, and the fourth sub-wire is located above the first sub-wire.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and first and second outer electrodes that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover parts of first and second end surfaces and parts of a first main surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the first main surface. In a plan view from the stacking direction, a repeating shape of the coil conductors is a non-circular shape, and distances between the first main surface and the parts of the coil conductors that face the first main surface are not constant.

An on-chip inductor includes a semiconductor substrate, a plurality of insulating layers stacked over the semiconductor substrate, and first, second and third spiral-shaped coil patterns. The first, second and third spiral-shaped coil patterns are inductively coupled to each other and sequentially disposed on respective layers among the plurality of insulating layers. Further, the first, second and third spiral-shaped coil patterns have respective first ends overlapping each other. The on-chip inductor further includes a first via connecting the respective first ends of the first and second spiral-shaped coil patterns to each other, and a second via connecting the respective first ends of the second and third spiral-shaped coil patterns to each other, where the first and second vias overlap each other.

A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

A coil component includes a coil part having a structure in which interlayer insulating films 51 to 55 and coil patterns CP1 to CP4 are alternately stacked in the coil axis direction and magnetic element bodies M1 to M4 embedding therein the coil part. A radial width of a part of the interlayer insulating film that is positioned between the magnetic element body M1 positioned in the inner diameter area of the coil part and the innermost turn of the coil pattern CP4 is larger than radial widths L11, L21, and L31 of parts of the interlayer insulating films 52 to 54 that are positioned between the magnetic element body M1 and the innermost turns of the coil patterns CP1 to CP3.

An electronic component includes a first insulator layer including thereon a first conductor pattern to define an inductor and a first electrode pattern to define a capacitor, and a second insulator layer including thereon a second conductor pattern to define the inductor and a second electrode pattern to define the capacitor. The first and second electrode patterns face each other across the second insulator layer to define the capacitor, and the second conductor pattern is electrically connected to the first conductor pattern along the first conductor pattern.

The present invention includes a method of a low cost, reliable novel broadband inductor that can be used with a capacitor to form a broadband filter.

The present invention relates to a magnetic coupling device that can become slim and a circuit board including same. A magnetic coupling device according to one embodiment of the present invention comprises: a core unit including an upper core and a lower core; and a coil unit of which a part is arranged in the core unit, and which includes a first coil unit and a second coil unit, wherein the first coil unit and the second coil unit have a substrate and conductive patterns arranged on both surfaces of the substrate, and the conductive patterns on both surfaces can be conducted through a plurality of via holes arranged in the extending direction of the conductive patterns.

An inductor coil includes: a substrate, including a base, a device layer on the base, a conductive layer, and an electrical interconnect structure; a plurality of stacked coil layers being on the substrate, each of the plurality of stacked coil layers including a plurality of sub-coil structures on a same layer; and a plurality of electrical connection layers between two adjacent coil layers, a projection pattern of each electrical connection layer on a surface of the substrate being within a range of projection patterns of two adjacent coil layers that are in contact with the plurality of electrical connection layers on the surface of the substrate, and all the plurality of coil layers being connected in parallel through all the plurality of electrical connection layers.