A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.

An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.

To improve magnetic characteristics of a coil component having a structure in which an interlayer insulating film is provided between a spiral coil pattern and a magnetic element body. A coil component 1 includes: an interlayer insulating film 41 covering coil patterns CP1 to CP3 from one side in the axial direction of the coil patterns; a magnetic element body M1 filled in the inner diameter areas of the coil patterns CP1 to CP3; and a magnetic element body M2 covering the coil patterns CP1 to CP3 from the one side in the axial direction through the interlayer insulating film 41. The interlayer insulating film 41 has a protruding part 41A radially protruding to the inner diameter area, and the protruding part 41A is curved to the other side in the axial direction. Since the protruding part 41A is curved in the axial direction, the entrance of a magnetic path passing through the inner diameter area is made wider than when the protruding part 41A linearly protrudes to the inner diameter area. This suppresses deterioration in magnetic characteristics due to the presence of the protruding part 41A.

A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace and the second sub-trace form a plurality of first wires together at a first side of the inductor device, and form a plurality of second wires together at a second side of the inductor device. The second sub-trace is coupled to one terminal of the first sub-trace at a first node. The third sub-trace and the fourth sub-trace form a plurality of third wires together at the first side of the inductor device, and form a plurality of fourth wires together at the second side of the inductor device. The fourth sub-trace is coupled to one terminal of the third sub-trace at a second node. The capacitor is coupled to the first node and the second node.

An inductor device includes a first trace, a second trace, and a connection member. The first inductor includes a first trace and a second trace. The shape of one of the first trace and the second trace is spiral. The second inductor includes a third trace and a fourth trace. The connection member is configured to couple the first inductor and the second inductor.

An inductor device includes first, second, third and fourth wire, first and second connector, and eight-shaped inductor structure. First and second wires are disposed in first and second areas. Third wire is disposed in first area and partially overlapped with first wire in a vertical direction, and third wire is coupled to second wire. Fourth wire is disposed in second area and partially overlapped with second wire in the vertical direction, and fourth wire is coupled to first wire. First connector is partially overlapped with first wire or third wire in the vertical direction, and is coupled to inner wire and outer wire of third wire. Second connector is partially overlapped with second wire or fourth wire in the vertical direction, and is coupled to inner and outer wire of fourth wire. Eight-shaped inductor structure is disposed on outer side of third wire and fourth wire.

An inductor device includes a first wire, a second wire, an input terminal, a third wire, a fourth wire, and an eight-shaped inductor structure. The first wire is disposed in a first area. The second wire is disposed in a second area. The input terminal is disposed on a first side of the second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction, in which the third wire is coupled to the first wire. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction, in which the fourth wire is coupled to the second wire. The eight-shaped inductor structure is disposed on an outer side of the third wire and the fourth wire.

Described is a high Q-factor inductor. The inductor is formed as a unit cell coil, which is copied twice for a dual-coil inductor and copied four times for a quad-coil inductor. For each copy of the unit cell coil, the coil is rotated a subsequent substantially 90 degrees or substantially −90 degrees. The rotation enables the terminals of the inductor to be routed equal-distant to a circuit that is placed in the line of symmetry between the two coils.