Patent classifications
H01F2017/0073
Multilayer coil component
A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover at least parts of first and second end surfaces. A stacking direction and a coil axis direction are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction is from 85% to 95% of a length of the multilayer body. A distance between coil conductors adjacent to each other in the stacking direction lies in a range from 12 μm to 40 μm.
Stacked inductor having a discrete metal-stack pattern
An inductor includes a first metallization layer multi-turn trace. The inductor also includes a second metallization layer multi-turn trace coupled to the first metallization layer multi-turn trace through at least one first via. The inductor further includes a plurality of discrete third metallization layer trace segments coupled to the second metallization layer multi-turn trace through a plurality of second vias.
MULTILAYER COIL COMPONENT
A multilayer coil component includes an element body, a coil, and an external electrode. The element body includes a main surface, side surfaces opposing each other in a first direction, and end surfaces opposing each other in a second direction. The external electrode is electrically connected to the coil. The coil includes a plurality of coil conductors disposed in the first direction. The external electrode includes a plurality of electrode conductors disposed in the first direction. The plurality of coil conductors include coil conductors positioned in the same layer as the plurality of electrode conductors and coil conductors not positioned in the same layer as any of the plurality of electrode conductors.
INDUCTOR DEVICE
An inductor device includes a plurality of coils, a first central connecting portion and a plurality of side connecting portions. The coils include a first winding including a plurality of first coils and a second winding including a plurality of second coils. The first central connecting portion is configured to couple the first coils and the second coils which are interleaved, so that a first one of the second coils is coupled to a second one of the second coils. The side connecting portions are configured on two sides of the first central connecting portion and each configured to couple the second one of the second coils to a third one of the second coils, so that the second one of the second coils and a first one of the first coils compose one of the coils of the inductor device.
INDUCTOR DEVICE
An inductor device includes a first winding, a second winding, a first connecting structure and a second connecting structure. The first winding includes a first coil and a second coil. The second winding includes a third coil and a fourth coil, the third coil is overlapped with the first coil, and the fourth coil is overlapped with the second coil. The first connecting structure includes a first crossing structure and a second crossing structure. The first crossing structure has a first crossing point and is configured to couple the first coil and the second coil. The second crossing structure has a second crossing point and is configured to couple the third coil and the fourth coil. The first crossing point is not overlapped with the second crossing point. The second connecting structure is configured to couple the second coil and the third coil.
INDUCTOR DEVICE
An inductor device includes a plurality of coils including a first winding and a second winding. The first winding includes a plurality of first sub-coils, wherein a first one of the plurality of first sub-coils is configured in a first region, and a second one and a third one of the plurality of first sub-coils are configured in a second region different from the first region. The second winding includes a plurality of second sub-coils, wherein a first one of the plurality of second sub-coils is configured in the second region, and a second one and a third one of the plurality of second sub-coils are configured in the first region. Each of the plurality of coils is composed of one of the plurality of first sub-coils and one of the plurality of second sub-coils.
INDUCTOR DEVICE
An inductor device is disclosed herein. An electrical device is disposed in a first area of the inductor device, and the inductor device includes a first trace and a second trace. The first trace is disposed in a second area. The second trace is disposed in the second area, and coupled to the first trace. The second area is disposed an outer side of the first area, and the first area and the second area are not overlapped with each other.
INDUCTOR DEVICE
An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces and a first crossing connection portion. One terminal of the at least two sub-traces is coupled to a first node. The first crossing connection portion is coupled between the at least two sub-traces of the first trace in an interlaced manner. The second trace includes at least two sub-traces. One terminal of the at least two sub-traces is coupled at a second node. The capacitor is coupled between the first node and the second node.
MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
A multilayer-type on-chip inductor includes a first winding portion arranged in an inter-metal dielectric (IMD) layer, which includes first and second semi-circular stacking layers arranged from inside to outside and in concentricity. A second winding portion includes third and fourth semi-circular stacking layers arranged symmetrically with the first semi-circular stacking layer and the second semi-circular stacking layer, respectively, with respect to a symmetry axis. A conductive branch layer is disposed in an insulating redistribution layer over the IMD layer. The first, second, third, and fourth semi-circular stacking layers each include an uppermost trace layer and a next uppermost trace layer vertically stacked under the uppermost trace layer.
INDUCTOR COMPONENT
An inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad. The second conductor is disposed to be shifted with respect to the first conductor in the first direction.