An inductor component comprising a first magnetic layer, a spiral wiring disposed on the first magnetic layer, and a second magnetic layer covering the spiral wiring. The first magnetic layer and the second magnetic layer contain a magnetic powder and a resin containing the magnetic powder, and the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer.

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

A coil component includes a body including opposing first and second side surfaces and opposing third and fourth side surfaces, a first coil portion disposed in the body, and including a first winding portion and first and second extension portions connected to the first winding portion, a second coil portion disposed in the body, and including a second winding portion disposed between the first side surface and the first winding portion, and third and fourth extension portions connected to the second winding portion, first and second external electrodes disposed on the body and respectively connected to the first and second extension portions, and third and fourth external electrodes disposed on the body and respectively connected to the third and fourth extension portions. The first extension portion of the first coil portion is disposed between the second winding portion and one of the third and fourth side surfaces.

An inductor device includes a first coil and a second coil. The first coil is wound into a plurality of first circles, and the second coil is wound into a plurality of second circles. At least two of the second circles are interlaced with at least two of the first circles on a first side. The at least two of the second circles are disposed adjacent to each other on the first side. At least one of the first circles is only interlaced with at least one of the second circles on a second side. At least another one of the first circles is only interlaced with at least another one of the second circles on the second side.

A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric layer, a first spiral trace layer disposed in the insulating redistribution layer, and a second spiral trace layer disposed in the inter-metal dielectric layer correspondingly formed below the first spiral trace layer, wherein the inter-metal dielectric layer has a separating region to divide the second spiral trace layer into a plurality of line segments, and wherein each of a plurality of first slit openings and each of a plurality of second slit openings pass through a corresponding line segment, and extend in an extending direction of a length of the corresponding line segment.

An inductor component includes an element body, a coil in the element body, and a non-magnetic insulation layer covering at least part of the coil. The element body includes first and second magnetic layers laminated in order in a first direction. The coil includes a small-turn inductor wiring of 0.5 or less turns extending along a plane orthogonal to the first direction between the first and second magnetic layers. In a first cross-section orthogonal to an extending direction of the small-turn inductor wiring, the small-turn inductor wiring has a top surface facing in the first direction, a bottom surface facing in a second direction opposite from the first direction, a first side surface facing in a third direction orthogonal to the first direction, and a second side surface facing in a fourth direction opposite from the third direction.

Exemplary embodiments of the disclosure are related to inductors, e.g., at least a pair of planar inductors for a wireless apparatus, for example transceivers used in a wireless device. A device may include a first planar inductor configured on a first area of a substrate. The first planar inductor includes a first loop configured to produce a first magnetic field in a first direction and a second loop configured to produce a second magnetic field in a second direction. The device further includes a second planar inductor configured on a second area of the substrate. The second planar inductor includes a third loop configured to produce a third magnetic field in a third direction. The third loop may be configured to surround the first loop and divide the second loop into an enclosed area and an external area.

Exemplary embodiments of the disclosure are related to inductors, e.g., at least a pair of planar inductors, for wireless communication apparatus, for example transceivers used in a wireless device. A device may include a first planar inductor configured on a first area of a substrate. The first planar inductor includes a first loop configured to produce a first magnetic field in a first direction and a second loop configured to produce a second magnetic field in a second direction. The device further includes a second planar inductor configured on a second area of the substrate. The second planar inductor includes a third loop configured to produce a third magnetic field in a third direction and a fourth loop configured to produce a fourth magnetic field in a fourth direction. The second area may at least partially overlap the first area.

According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.

A multilayer-type coil component including an element body including insulating layers laminated in a laminating direction; first and second coils inside the element body and insulated from each other; first and second outer electrodes on a surface of the element body and electrically connected to the first coil; third and fourth outer electrodes on the surface of the element body and electrically connected to the second coil. The laminating direction, and respective directions of coil axes of the first and second coils are parallel to a mount surface of the element body along a same direction. The first and second coils include first and second coil conductors, respectively, laminated in the laminating direction. Each of the first coil conductors has a length smaller than one turn of the first coil. Each of the second coil conductors has a length smaller than one turn of the second coil.