A surface mount inductor includes a coil buried in a composite material including a magnetic powder; outer terminals connected to the coil; and a molded body having a metal surface that intersects a winding axis of the coil and including the composite material. A surface mount inductor manufacturing method includes arranging, inside a mold, a metal plate having a shape covering part of a surface of a molded body; arranging a coil and a composite material including a magnetic powder or a preliminary molded body composed of the composite material inside the mold in which the metal plate has been arranged; and forming a molded body in which the coil is buried and that has the metal plate arranged on part of a surface of the molded body by molding the metal plate, the composite material, and the coil inside the mold to be integrated with each other.

According to one aspect of the present disclosed subject matter, a receiver inductively powered by a transmitter for powering a load, the receiver comprising: a resonance circuit capable of tuning its resonance frequency for coupling with the transmitter and generate AC voltage; a power supply section configured to rectify the AC voltage and adjust a DC current and a DC voltage to the load; and a control and communication section designed to set parameters for the receiver and communicate operation points (OP) to the transmitter, wherein the parameters and the OP derived from determining a minimal power loss of the receiver.

A multilayer inductor is provided. The multilayer inductor includes a multilayer winding portion comprising a plurality of coil layers that are vertically stacked, and having an inner surface that defines a hollow of the plurality of coil layers and having an outer surface that defines an outer side and a magnetic compensator made of a soft magnetic material and comprising a magnetic wall located at at least one of the inner surface or the outer surface of the multilayer winding portion.

A coil component includes: a body having a first surface and a second surface opposing each other in one direction and including a core extending in the one direction; a coil portion embedded in the body and having at least one turn around the core; and an external electrode disposed at least on the first surface of the body and connected to the coil portion. A first distance from the coil portion to a third surface of the body is greater than a second distance from the coil portion to a fourth surface of the body. The third and fourth surfaces oppose each other and have the core disposed therebetween. Turns of the coil portion disposed between the third surface of the body and the core are more than those of the coil portion disposed between the fourth of the body and the core.

An electronic component includes a common port, a first signal port that selectively passes a first signal of a frequency within a first passband, a second signal port that selectively passes a second signal of a frequency within a second passband higher than the first passband, a first resonator provided between the common port and the first signal port in a circuit configuration, a second resonator provided between the common port and the second signal port in the circuit configuration, a stack, and a shield that covers a part of a surface of the stack. The shield includes a specific portion opposed to both the first and second resonators. A distance between the second resonator and the specific portion is greater than a distance between the first resonator and the specific portion.

A patterned ground shield device includes a first patterned ground shield layer and a second patterned ground shield layer. The first patterned ground shield layer is located on a first layer, and the second patterned ground shield layer is located on a second layer. The first patterned ground shield layer includes a plurality of first strip-shaped structures, and each of the first strip-shaped structures includes an oxide diffusion material. The second patterned ground shield layer includes a plurality of second strip-shaped structures, and each of the second strip-shaped structures includes a conductive material, wherein the first strip-shaped structures and the second strip-shaped structures are disposed to each other in an interlaced manner.

A coil component includes a body, a support substrate buried in the body, a coil portion disposed on at least one surface of the support substrate and having both ends exposed to a surface of the body, a noise removing portion disposed on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop such that one end of the noise removing portion is exposed to a surface of the body, an insulating layer disposed between the coil portion and the noise removing portion, first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively, and a third external electrode disposed on a surface of the body and connected to the one end of the noise removing portion.

According to one configuration, an inductor device includes a core fabricated from multiple different types of magnetically permeable material. The inductor device includes an electrically conductive path extending through the core. A magnetic permeability of the core varies in magnitude depending on a distance with respect to the electrically conductive path.

An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.

A laminated shielding inductor includes a laminated body, an internal coil, and a shielding cover; the laminated body includes a plurality of insulator layers; shielding conductor through grooves which are located at the periphery of the internal coil are formed in the plurality of insulator layers; shielding conductors are arranged in the shielding conductor through grooves, are electrically and mutually connected and jointly form a shielding conductor laminated layer; a shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal coil; and the shielding conductor laminated layer, the shielding conductor upper layer and the shielding conductor lower layer are closed to form the shielding cover. Thus, high shielding effect of the laminated chip inductor can be realized, external radiation of the laminated chip inductor is effectively reduced, and the reliability of a circuit system is improved.