A coil component includes a body, a support substrate buried in the body, a coil portion disposed on at least one surface of the support substrate and having both ends exposed to a surface of the body, a noise removing portion disposed on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop such that one end of the noise removing portion is exposed to a surface of the body, an insulating layer disposed between the coil portion and the noise removing portion, first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively, and a third external electrode disposed on a surface of the body and connected to the one end of the noise removing portion.

A microelectronic device may include a substrate, a component, a first plate, a second plate, and a shield. The component may be disposed at least partially within the substrate. The first plate may be disposed on a first side of the component. The second plate may be disposed on a second side of the component. The shield may be disposed around at least a portion of a periphery of the component.

The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.

A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.

Disclosed microelectronic assemblies employ an integrated interposer cage to reduce electromagnetic interference with (and from) high-frequency components. One illustrative embodiment includes: at least one IC die having drive cores for a plurality of oscillators, the IC die attached in a flip-chip configuration to a (interposer) substrate, the substrate having: multiple inductors electrically coupled to said drive cores and each enclosed within a corresponding conductive cage integrated into the substrate to reduce mutual coupling between the inductors and noise coupled through substrate. An illustrative interposer embodiment includes: upper contacts arranged to electrically connect with micro bumps on at least one IC die; metallization and dielectric layers that form multiple inductors each surrounded by bars of a conductive cage; lower contacts arranged to electrically connect with bumps on a package substrate; and a substrate with a plurality of TSVs (through-silicon vias) that electrically couple to the lower contacts. Each of the bars includes: at least one of said TSVs, at least one via through the metallization and dielectric layers, and at least one upper contact.

According to one aspect of the present disclosed subject matter, a receiver inductively powered by a transmitter for powering a load, the receiver comprising: a resonance circuit capable of tuning its resonance frequency for coupling with the transmitter and generate AC voltage; a power supply section configured to rectify the AC voltage and adjust a DC current and a DC voltage to the load; and a control and communication section designed to set parameters for the receiver and communicate operation points (OP) to the transmitter, wherein the parameters and the OP derived from determining a minimal power loss of the receiver.

An integrated inductor is disclosed herein. The integrated inductor includes a substrate, an insulation layer, and an inductor. The substrate includes a trench. At least a portion of the insulation layer is formed in the trench. The inductor is disposed in the trench, and the inductor is disposed on the insulation layer.

A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

Various embodiments include a circuit arrangement comprising: a heat sink; and a set of layers arranged on a surface of the heat sink. The set of layers includes a first electrically insulating insulation layer and an electrically conductive conductor layer arranged on a side of the insulation layer facing away from the heat sink. The set of layers includes an electrical connecting path between two electrical connection regions. At least one layer of the set of layers is formed by cold gas spraying of a respective material.