Patent classifications
H01F2017/048
COIL COMPONENT
A coil component includes: a body; a coil portion including a coil pattern disposed in the body and first and second lead portions exposed to a first surface of the body to be spaced apart from each other; and first and second external electrodes disposed on the first surface of the body and spaced apart from each other and connected to the first and second lead portions, respectively, wherein in a cross-section perpendicular to the first surface of the body, a curved portion having a radius of curvature of 1 μm or more is formed in a region in which each of the first and second lead portions and an outermost turn of the coil pattern are connected to each other.
COIL COMPONENT
A coil component includes: a body; a coil unit including lead-out ends and coils, and embedded in the body; and a core penetrating through the coil unit in a first direction, wherein a cross-section of each of the coils perpendicular to a direction in which the coil is wound has a plurality of round portions disposed on a side facing the core.
Wire wound inductor and manufacturing method thereof
There are provided a wire wound inductor and a manufacturing method thereof according to an exemplary embodiment in the present disclosure. The wire wound inductor according to an exemplary embodiment in the present disclosure includes a winding coil, a magnetic core embedding the winding coil, and an adhesive portion disposed between the magnetic core and the winding coil and enclosing the winding coil.
Coil electronic component
A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.
Coil component
A coil component includes a body; an insulating substrate embedded in the body; and a coil portion disposed on at least one surface of the insulating substrate. The insulating substrate is inclined with respect to one surface of the body, in a cross-section of the body in a width-thickness direction.
Coil component
A coil component including an element assembly that includes a support substrate having a cavity, a first coil disposed on a first principal surface of the support substrate, a second coil disposed on a second principal surface of the support substrate, and a magnetic portion. The coil component further includes first and second outer electrodes electrode electrically coupled to the first coil, and third and further outer electrodes electrically coupled to the second coil. Each outer electrode is disposed on the surface of the element assembly. The cavity of the support substrate, the core portion of the first coil, and the core portion of the second coil overlap at least one another when viewed in the direction perpendicular to the principal surface. The magnetic portion is disposed in at least the cavity and the two core portions. Also, the support substrate is formed of sintered ferrite.
Composite magnetic particle including metal magnetic particle
A composite magnetic body according to one aspect of the present invention includes a first metal magnetic particle covered with a first resin portion made of a first resin material and a second metal magnetic particle having a smaller particle size than the first metal magnetic particle, where the second metal magnetic particle is bound to the first metal magnetic particle via a second resin portion made of a second resin material and the second resin material has a larger molecular weight than the first resin material.
Coil electronic component
A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.
DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A MAGNETIC MATERIAL BASED INDUCTOR
Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.
ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS, AND METHODS OF MANUFACTURING ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS
Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.