H01F17/06

MAGNETIC CORE, INDUCTOR, AND EMI FILTER COMPRISING SAME
20220172871 · 2022-06-02 ·

An inductor according to an embodiment of the present invention comprises: a first magnetic body having a toroidal shape, and including a ferrite; and a second magnetic body disposed on an outer circumferential surface or an inner circumferential surface of the first magnetic body, wherein the second magnetic body includes: resin material and a plurality of layers of metal ribbons wound along the circumferential direction of the first magnetic body, wherein the resin material comprises a first resin material disposed to cover an outer surface of the plurality of layers of metal ribbons, and a second resin material disposed in at least a part of a plurality of layers of interlayer spaces.

MAGNETIC CORE, INDUCTOR, AND EMI FILTER COMPRISING SAME
20220172871 · 2022-06-02 ·

An inductor according to an embodiment of the present invention comprises: a first magnetic body having a toroidal shape, and including a ferrite; and a second magnetic body disposed on an outer circumferential surface or an inner circumferential surface of the first magnetic body, wherein the second magnetic body includes: resin material and a plurality of layers of metal ribbons wound along the circumferential direction of the first magnetic body, wherein the resin material comprises a first resin material disposed to cover an outer surface of the plurality of layers of metal ribbons, and a second resin material disposed in at least a part of a plurality of layers of interlayer spaces.

APPARATUS
20220172881 · 2022-06-02 ·

An apparatus includes a heat-dissipating substrate, a power circuit and a magnetic assembly. The heat-dissipating substrate includes a thermal contact surface. The power circuit includes at least one switch element in contact with the thermal contact surface of the heat-dissipating substrate. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The heat-dissipating substrate, the power circuit and the magnetic assembly are arranged in sequence along a same direction. A projection of the power circuit on the thermal contact surface partially overlaps a projection of the magnetic assembly on the thermal contact surface.

Coil component and method of manufacturing coil component

A coil component includes: a core having an annular shape; a coil wound around the core; and an electrode terminal for mounting the coil component. The electrode terminal is connected to the coil and has a mounting surface. The coil is formed by connecting a plurality of wire members. The electrode terminal has a recessed portion indented toward a back surface on a side opposite to the mounting surface. The wire member of the coil is connected to a back surface of a bottom portion of the recessed portion.

POWER CONVERTER EMBODIED IN A SEMICONDUCTOR SUBSTRATE MEMBER
20230275120 · 2023-08-31 ·

A power converter is embodied on a semiconductor substrate member and has a first region with a passive electrical component with a first electrically conductive layer pattern of an electrically conductive material and a second electrically conductive layer pattern of an electrically conductive material deposited on respective sides of the semiconductor substrate member. A trench or through-hole is formed (by etching) in the substrate within the first region, and the electrically conductive material is deposited at least on a bottom portion of the trench or on a sidewall of the through-hole and electrically connected to one or both of the first conductive layer pattern and the second conductive layer pattern. A second region has an active semiconductor component integrated with the semiconductor substrate by being fabricated by a semiconductor fabrication process. There is also provided a power supply, such as a DC-DC converter, embedded the semiconductor substrate member.

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF
20230275045 · 2023-08-31 ·

A method includes: forming an interconnect structure over a semiconductor substrate. The interconnect structure includes: a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core. The conductive coil includes horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure; and a connecting metal line adjacent to and on an outside of the inductor zone, the connecting metal line being electrical isolated from the inductor zone. The vertically-extending conductive vias include first conductive vias, second conductive vias, and a third conductive via between the first conductive vias and the second conductive vias. The connecting metal line is between, and non-overlapped with, the first conductive via and the second conductive vias vertically from a cross-sectional view.

HYBRID INDUCTIVE DEVICE
20220165484 · 2022-05-26 ·

A hybrid inductive device includes a magnetic core and a plurality of coil windings. The magnetic core has a plurality of winding areas. The plurality of coil windings are respectively wound in the plurality of winding areas. A gap is between the coil windings in two adjacent winding areas. A winding direction of the coil winding in each of the plurality of winding areas on the magnetic core is different from winding directions of the coil windings in the adjacent winding areas on the magnetic core. The coil winding in each of the plurality of winding areas is symmetrical to the coil windings in the adjacent winding areas.

EMC FILTER FOR ELECTROMAGNETIC REGULATION OF CONVERTER AND MANUFACTURING METHOD THEREOF

Provided is an electro-magnetic compatibility (EMC) filter including a lower bobbin having a U-shaped cross-sectional shape, a lower core including a magnetic material having a U-shaped cross-sectional shape and disposed on the lower bobbin, a bus bar disposed on the lower core, an upper bobbin having a hollow inside, having a hexahedral shape with one side open, and configured to cover an upper portion of the lower bobbin, and an upper core including a magnetic material having a plate-like shape, disposed in an internal space of the upper bobbin, and disposed on the lower core (U core) to cover the bus bar with a gap maintained by the bus bar between the upper and lower cores when the lower bobbin and the upper bobbin are coupled to each other.

EMC FILTER FOR ELECTROMAGNETIC REGULATION OF CONVERTER AND MANUFACTURING METHOD THEREOF

Provided is an electro-magnetic compatibility (EMC) filter including a lower bobbin having a U-shaped cross-sectional shape, a lower core including a magnetic material having a U-shaped cross-sectional shape and disposed on the lower bobbin, a bus bar disposed on the lower core, an upper bobbin having a hollow inside, having a hexahedral shape with one side open, and configured to cover an upper portion of the lower bobbin, and an upper core including a magnetic material having a plate-like shape, disposed in an internal space of the upper bobbin, and disposed on the lower core (U core) to cover the bus bar with a gap maintained by the bus bar between the upper and lower cores when the lower bobbin and the upper bobbin are coupled to each other.

Inductor arrangement comprising an insert

A inductor arrangement has a toroidal core with a central opening, a winding which is arranged around the core and has two winding ends, and an electrically insulating insert which is inserted into the central opening in a clamping manner. Here, the winding ends are inserted into the insert in a clamping manner.