A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on the conductive columns, opposite from the first lateral conductors, extending laterally in a plane parallel to the terminal surface. A first set of the first lateral conductors, the conductive columns, and the second lateral conductors provide the bump bonds of the microelectronic device. A second set of the first lateral conductors, the conductive columns, and the second lateral conductors are electrically coupled in series to form the inductor. Methods of forming the microelectronic device are also disclosed.

A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.

A wire harness including: a wire; a cover that covers an outer circumference of a portion of the wire in a length direction thereof; an electromagnetic wave absorber mounted on an outer circumference of the cover; and a fixing member that fixes one end of the cover in a length direction thereof to the wire, wherein: the electromagnetic wave absorber includes a ring-shaped magnetic substance core, and a ring-shaped case in which the magnetic substance core is housed, the cover includes a first latch formed on an outer circumferential surface of the cover, and the case includes a second latch that latches to the first latch in the length direction of the cover.

A wire harness including: a wire; a cover that covers an outer circumference of a portion of the wire in a length direction thereof; an electromagnetic wave absorber mounted on an outer circumference of the cover; and a fixing member that fixes one end of the cover in a length direction thereof to the wire, wherein: the electromagnetic wave absorber includes a ring-shaped magnetic substance core, and a ring-shaped case in which the magnetic substance core is housed, the cover includes a first latch formed on an outer circumferential surface of the cover, and the case includes a second latch that latches to the first latch in the length direction of the cover.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

A power converter module includes a multilayer printed circuit board, a switching device, a magnetic core element and a winding via. The multilayer printed circuit board has a first surface, a second surface and an inside layer. The multilayer printed circuit board includes a plurality of copper layers. The magnetic core element is disposed in the inside layer and includes a hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second surface. The winding via penetrates through the hole and forms a magnetic assembly. An amount of the copper layers on a first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least two more than a second side of the magnetic core element.

A coil component includes a winding core section. A first flange section and a second flange section are disposed on a first end and a second end of the winding core section in the axial direction, respectively. A second terminal electrode is disposed on the first flange section on a second end side in a first direction perpendicular to the axial direction. A fourth terminal electrode is disposed on the second flange section on a second end side in the first direction. When in a portion of the second wire wound around the winding core section, a single round nearest an end connected to the fourth terminal electrode is defined as the Nth turn, at least two turns of the wire closer to the second flange section than the Nth turn of the second wire in the axial direction are present.

A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

An inductor built-in substrate includes a core substrate having an opening, a magnetic resin body having a through hole and including a magnetic resin filled in the opening of the core substrate, and a plating film formed in the through hole of the magnetic resin body and including an electrolytic plating film such that the electrolytic plating film is formed in contact with the magnetic resin body.