The present disclosure relates to a docking module for a current transformer comprising: an electronic circuit and at least one electric connecting element for electrically coupling the circuit to the current transformer and for docking the docking module onto the current transformer.

An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.

An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.

The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Disclosed are apparatus and methods for embedded high voltage transformer components. Industrial applications require transformers that provide high voltage isolation. The laminate materials used for fabricating Printed Circuit Boards (PCB) are very good insulators and PCB transformers can provide higher voltage isolation than traditional wire wound devices. There are a variety of PCB laminate materials with different properties for voltage breakdown. FR-4 laminate is commonly used and has voltage breakdown properties exceeding 10 kV/mm. To produce PCB transformers with breakdown voltages exceeding 5 kV, it is beneficial to use laminate with much higher breakdown voltages. Generally, the materials with high breakdown voltage cost more. High voltage isolation can be achieved at a moderate cost by mixing low cost FR-4 laminate with high voltage dielectric materials.

A current transformer assembly includes a first current transformer, a plug, a first wire and a second wire between the plug and the first current transformer adapted to transmit a measurement of the first current transformer; and a memory chip adapted to store a first scale factor of the first current transformer.

A header component for mounting an inductive component on a substrate comprises a housing for housing the inductive component inside a cavity, wherein the housing confines the cavity to a bottom side and to at least three lateral sides, and wherein the housing comprises a top opening to the cavity at a top side opposite to the bottom side, wherein the top opening is configured for inserting the inductive component into the cavity via the top opening. The header component further comprises a plurality of terminals for electrically connecting the inductive component to the substrate, wherein the terminals outwardly protrude from the housing at the bottom side. Further disclosed are an inductive device and a method for assembling an inductive device.

A choke module having a choke that includes a magnetic core and at least one winding and a support having a capacitor plate. The plate includes at least one first electrode layer, at least one second electrode layer, and at least one dielectric layer. The choke is located on the capacitor plate.

A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.

Disclosed herein is a coil component including a base body having a magnetic body portion containing a metal magnetic material, a conductor provided inside the base body, an insulating layer that is provided on a surface of the magnetic body portion in the base body and that is a resin containing carbon particles, and an external electrode that extends along the surface of the base body and that is connected to the conductor.