Patent classifications
H01F27/027
EMBEDDED HIGH VOLTAGE TRANSFORMER COMPONENTS AND METHODS
Disclosed are apparatus and methods for embedded high voltage transformer components. Industrial applications require transformers that provide high voltage isolation. The laminate materials used for fabricating Printed Circuit Boards (PCB) are very good insulators and PCB transformers can provide higher voltage isolation than traditional wire wound devices. There are a variety of PCB laminate materials with different properties for voltage breakdown. FR-4 laminate is commonly used and has voltage breakdown properties exceeding 10 kV/mm. To produce PCB transformers with breakdown voltages exceeding 5 kV, it is beneficial to use laminate with much higher breakdown voltages. Generally, the materials with high breakdown voltage cost more. High voltage isolation can be achieved at a moderate cost by mixing low cost FR-4 laminate with high voltage dielectric materials.
SYSTEM IN PACKAGE DEVICE INCLUDING INDUCTOR
Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 ms.
Electronics system and method of forming same
Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion.
Method for gapping an embedded magnetic device
A method for gapping a magnetic component is disclosed. The method includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material to wrap the permeability material between the first conductive pattern and the second conductive pattern to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.
METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT
An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT
An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
CHOKE ARRANGEMENT AND RECEPTACLE FOR THE CHOKE ARRANGEMENT
The invention, which relates to a choke arrangement (1) for application in an EMC filter, has as its objective specifying a choke arrangement (1) that is mechanically robust and that enables improved insulation of the windings (4, 5). The objective is attained by disposing about the toroidal core (10) a two-part enclosure (15) and by disposing an insulation web (19) in the two-part enclosure (15).
Power supply apparatus
A power supply apparatus includes a board including a major surface on which a circuit element group is mounted, and a case attached to the board. The case includes a plate-shaped portion that is located at a distance from the board and faces the major surface, and a side wall portion extending from the plate-shaped portion toward one end portion of the board. One end of a specific circuit element among the circuit element group reaches the one end portion of the board, the one end of the specific circuit element being directed to the side wall portion. The side wall portion is provided with a notch portion with a shape corresponding to an outer shape of the one end of the specific circuit element.
MAGNETIC ELEMENT, MANUFACTURING METHOD AND POWER SUPPLY CIRCUIT THEREOF
A magnetic element can include: at least one group of inner cores; where each group of inner cores comprises a lower magnetic core cover plate, a first winding, at least one middle magnetic core cover plate, a second winding, and an upper magnetic core cover plate that are stacked in sequence; where the first winding and the second winding are spaced by the at least one corresponding middle magnetic core cover plate; and where materials of the upper magnetic core cover plate, the middle magnetic core cover plate, and the lower magnetic core cover plate comprise a metal magnetic powder core material.
Coil component
A coil component having a structure that can easily realize a desired positional relationship between a cover member and a bobbin portion is provided. The coil component includes a bobbin portion, a magnetic core inserted through the bobbin portion, and a coil wound around the bobbin portion, and a cover member covering the bobbin portion by being externally fitted to the bobbin portion. In the coil component, the cover member and the bobbin portion abut each other, and at least one of the cover member and the bobbin portion elastically biases the other in a first direction parallel to a mounting surface.