Patent classifications
H01F27/027
Integrated chip inductor structure
The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.
INTEGRATED CIRCUIT
An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.
HIGH VOLTAGE INSTRUMENT TRANSFORMER AND METHOD FOR PARTIAL DISCHARGE RECOGNITION
A high voltage instrument transformer includes a measuring assembly and isolator, with at least one sensor for partial discharge measurements. A method for partial discharge recognition in high voltage instrument transformers includes a detection of a signal from at least one sensor for partial discharge measurements, particularly a Transient Earth Voltage sensor.
Apparatus for an inductor disposed in a band for method of heat dispersion
Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Coil component
A coil component includes: a laminate including a magnetic portion and an insulator, the insulator having a higher insulation quality than the magnetic portion; a first external electrode; a second external electrode; and a coil conductor provided in the laminate, wherein the coil conductor includes a plurality of conductor patterns each extending along a planar direction perpendicular to the coil axis, the plurality of conductor patterns being separated from each other in the direction of the coil axis, the plurality of conductor patterns include a first conductor pattern and a second conductor pattern, the first conductor pattern contacting with the first external electrode, the second conductor pattern contacting with the second external electrode, and in the planar direction, the insulator is provided between the first conductor pattern and the second external electrode and between the second conductor pattern and the first external electrode.
CONNECTION STRUCTURE OF INDUCTIVE ELEMENT
A connection structure of an inductive element includes a circuit substrate, in inductive element, at least one connection wire, a supporting element, a containing element, a positioning element, a connecting element, and a locking element. The circuit substrate has a through hole. Each connection wire has a first end connected to the inductive element, and a fixed terminal is disposed on a second end of the connection wire. The containing element is formed on the supporting element to provide a containing space. The positioning element is contained in the containing space, and provides a positioning part. The connecting element has a first connecting part and a second connecting part. The first connecting part is connected to the positioning part to clip the fixed terminal. The locking element has a locking part. The locking part is connected to the second connecting part to lock on the circuit substrate.
COIL COMPONENT
A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.
Wire-wound coil component and drum core
One object of the present invention is to provide a wire-wound coil component and a drum core that can be manufactured easily and less affected by an inter-wire capacitance. A coil component includes: a drum core having a winding core extending along a front-rear direction and a first flange provided on a front end of the winding core; a first conductor wire wound around the winding core of the drum core; and a second conductor wire wound on an outer side of the first conductor wire in a direction orthogonal to the front-rear direction, wherein turns of a same number of the first conductor wire and the second conductor wire contact with each other, while turns of different numbers of the first conductor wire and the second conductor wire are separated from each other.
INTEGRATED CHIP INDUCTOR STRUCTURE
The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.
Electronic Device Having Reconfigurable Multi-Coil Transformer with Frequency Selective Filtering
An electronic device may include wireless circuitry having a transformer adjustable between first, second, and third modes. The transformer may have first, second, third, and fourth inductors. The third inductor may be magnetically coupled to the first and second inductors with equal coupling constants. The fourth inductor may be magnetically coupled to the first and second inductors with inverse coupling constants. First and second adjustable capacitors coupled to the third and fourth inductors may receive control signals that place the transformer into a selected one of the first, second, or third modes. In the first mode the transformer exhibits a passband that overlaps first and second bands. In the second mode, the transformer passes signals in the second band while filtering interference in the first band. In the third mode, the transformer passes signals in the first band while filtering interference in the second band.