Patent classifications
H01F27/22
Magnetic component structure with thermal conductive filler and method of fabricating the same
An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.
COIL COMPONENT
In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.
Service switch for utility meter
A utility meter includes an electrical conductor portion, a service switch, and a heat sink. The electrical conductor portion provides electrical communication between a supply line terminal and a load line terminal, and the supply line terminal electrical communication an electrical source. The service switch is selectively operable to interrupt electrical communication between the supply line terminal and the load line terminal. The heat sink is in thermal communication with the electrical conductor portion to dissipate heat generated by a current passing through the electrical conductor portion between the supply line terminal and the load line terminal.
Service switch for utility meter
A utility meter includes an electrical conductor portion, a service switch, and a heat sink. The electrical conductor portion provides electrical communication between a supply line terminal and a load line terminal, and the supply line terminal electrical communication an electrical source. The service switch is selectively operable to interrupt electrical communication between the supply line terminal and the load line terminal. The heat sink is in thermal communication with the electrical conductor portion to dissipate heat generated by a current passing through the electrical conductor portion between the supply line terminal and the load line terminal.
INDUCTOR AND ELECTRONIC DEVICE
An inductor (100) is provided, and includes an inductor winding (10), a housing (20), and a thermally conductive packaging material (30). The inductor winding is disposed in the housing. The thermally conductive packaging material is potted in the housing to fill a gap between the inductor winding and the housing. The thermally conductive packaging material includes a first packaging layer (31) and a second packaging layer (32), and a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall (21) and a packaging wall (22), and the first packaging layer is closer to the heat dissipation wall than the second packaging layer. Heat generated by the inductor can be dissipated after being transmitted to each surface of the housing through the thermally conductive packaging material.
INDUCTOR AND ELECTRONIC DEVICE
An inductor (100) is provided, and includes an inductor winding (10), a housing (20), and a thermally conductive packaging material (30). The inductor winding is disposed in the housing. The thermally conductive packaging material is potted in the housing to fill a gap between the inductor winding and the housing. The thermally conductive packaging material includes a first packaging layer (31) and a second packaging layer (32), and a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall (21) and a packaging wall (22), and the first packaging layer is closer to the heat dissipation wall than the second packaging layer. Heat generated by the inductor can be dissipated after being transmitted to each surface of the housing through the thermally conductive packaging material.
MAGNETIC COMPONENT STRUCTURE WITH THERMAL CONDUCTIVE FILLER
A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.
POWER MODULE AND SOLID-STATE TRANSFORMER SYSTEM
The present disclosure provides a power module and a solid-state transformer system. The power module includes: a circuit module, having a voltage level; and a cabin, configured to wrap the circuit module by bending or splicing, where the cabin has a shielding structure, the shielding structure including: a first conductor layer, located at a side close to the circuit module and equipotentially connected to the circuit module; a second conductor layer, arranged apart from the first conductor layer and located at a side away from the circuit module; and a solid insulating layer, provided between the first conductor layer and the second conductor layer for electrically isolating the first conductor layer and the second conductor layer. The power module provided by the present disclosure has good insulation performance and is easy to assemble.
POWER MODULE AND SOLID-STATE TRANSFORMER SYSTEM
The present disclosure provides a power module and a solid-state transformer system. The power module includes: a circuit module, having a voltage level; and a cabin, configured to wrap the circuit module by bending or splicing, where the cabin has a shielding structure, the shielding structure including: a first conductor layer, located at a side close to the circuit module and equipotentially connected to the circuit module; a second conductor layer, arranged apart from the first conductor layer and located at a side away from the circuit module; and a solid insulating layer, provided between the first conductor layer and the second conductor layer for electrically isolating the first conductor layer and the second conductor layer. The power module provided by the present disclosure has good insulation performance and is easy to assemble.
Coil structure
The first core includes a main body part extending in a first direction along a main surface of the substrate, a first foot part extending from the main body part to the second core through the substrate, and a second foot part extending from the main body part to the second core through the substrate at a position at which the coil conductor is sandwiched between itself and the first foot part in the first direction, and the insulating member includes a bottom wall part interposed between at least the first foot part and the second core, and a side wall part extending along at least either of the first foot part and the second foot part and interposed between either of the foot parts and the coil conductor.