A multilayer coil component includes an element body including a plurality of laminated insulator layers, and a coil disposed in the element body. The coil includes a first coil conductor having a first inner diameter, a second coil conductor having a second inner diameter smaller than the first inner diameter, and a connection conductor connecting the first coil conductor and the second coil conductor. The second coil conductor is adjacent to the first coil conductor in a direction in which the plurality of insulator layers are laminated. The connection conductor has a shape along the first coil conductor and the second coil conductor.

An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.

A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB.

The present disclosure relates to an electronic component and a method for manufacturing the same, and more particularly, to a surface mounting type electronic component provided on an electronic device and a method for manufacturing the same.

An electronic component in accordance with an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed as at least a portion of a plurality of edges at which two mutually adjacent surfaces meet is recessed, an insulation part provided on a surface of the main body part to cover the recessed portion, and an electrode part separately provided on the surface of the main body part except for an area on which the insulation part is provided.

A coil component may include a body, a coil portion including first and second lead-out portions spaced apart from each other, first and second slit portions formed at an edge portion and exposing the first and second lead-out portions, first and second external electrodes disposed to be spaced apart from each other on one surface of the body, and extending onto the first and second slit portions, respectively, to be connected to the first and second lead-out portions, a slit insulating layer covering at least portions of the first and second external electrodes in the first and second slit portions, and a surface insulating layer disposed on the slit insulating layer and extending to cover at least portions of the first or second external electrodes disposed on the one surface of the body.

A coil component improving insulation between external terminals provided on the same surface of an element body is provided. In the coil component, when a voltage is applied via the external terminal electrode, for example, a potential difference may occur between the outer end portions. In the coil component, since the insulation between the outer end portions is enhanced by the upper insulator exposed on the end face of the element body, even when a potential difference occurs between the outer end portions, a situation in which the outer end portions are short-circuited on the end face is prevented.

The disclosure provides a power supply module, including: a pin; a magnetic core including: a first and second magnetic plate arranged in parallel; a first upper wiring layer; a first middle wiring layer; a first lower wiring layer, wherein at least a part of the first upper wiring layer and the first middle wiring layer are connected to form a first winding surrounding the first magnetic plate, at least a part of the first lower wiring layer and the first middle wiring layer are connected to form a second winding surrounding the second magnetic plate. The magnetic core, the first and second winding form a magnetic element electrically connected to a switch. A magnetic loop surrounds a first axis, the first winding surrounds a second axis, the second winding surrounds a third axis, the first, second and third axis are parallel to a plane where the pin is located.

The present invention provides a magnetic element, a method for manufacturing the same and a substrate. The magnetic element includes: a first wiring region including a first conductive layer and a second conductive layer which are arranged along a first direction; a second wiring region including a third conductive layer and a fourth conductive layer which are arranged along a second direction perpendicular to the first direction and are disposed in opposite sides of the second wiring region, respectively; an accommodating space disposed between the third conductive layer and the fourth conductive layer, wherein the second conductive layer is disposed on one side of the first conductive layer away from the accommodating space; and a magnetic column disposed within the accommodating space, wherein the third conductive layer includes a first wiring region directly connected to the first conductive layer, to form a part of windings of the magnetic element.

The disclosure provides a magnetic element and a power supply module. The magnetic element includes a first and second magnetic column, a first winding formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part, and a second winding formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part sequentially connected. The first left/middle/right metal parts and the second left/middle/right metal parts are formed on a first substrate having a first upper and lower groove in which the first and second magnetic columns are disposed respectively. The magnetic element and the power supply module in the application use circuit boards having symmetric groove structures, the process is simple, thereby facilitating panel production mode, easy for automation, and lowering cost.

A power supply module includes a power supply submodule, a plurality of pins, and a second winding unit. The power supply submodule includes a switch, a magnetic core assembly, and a first winding unit including a first winding portion and a second winding portion. The second winding unit includes a third winding portion connected to the first winding portion via some of the plurality of pins to form a first winding, and a fourth winding portion connected to the second winding portion via some of the plurality of pins to form a second winding. The magnetic core assembly, at least the first winding, and the second winding form a magnetic element. The switch is disposed on and electrically connected to the magnetic element. At least one of the plurality of pins is an output pin via which the power supply module powers an intelligent IC load.