H01F27/2804

Coil component and wireless power transmission device provided with the same

Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.

Sub-surface wireless charging

In an embodiment, a sub-surface wireless charger includes a transmitter coil and a controller. The controller is configured to generate a protective pulse having a first energy, determine a characteristic of the transmitter coil based on the generated protective pulse, determine whether it is safe to begin wireless charging based on the determined characteristic, and when the controller determines that it is safe to begin wireless charging, generate an operating pulse having a second energy, where the second energy is higher than the first energy.

MULTILAYER INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER INDUCTOR COMPONENT

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

PLANAR COIL, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR COMPRISING SAME
20230055987 · 2023-02-23 ·

A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).

SEMICONDUCTOR DEVICE
20220367603 · 2022-11-17 ·

A semiconductor device includes a semiconductor chip that has a main surface, an insulating layer that is formed on the main surface, a functional device that is formed in at least one among the semiconductor chip and the insulating layer, a low potential terminal that is formed on the insulating layer and is electrically connected to the functional device, a high potential terminal that is formed on the insulating layer at an interval from the low potential terminal and is electrically connected to the functional device, and a seal conductor that is embedded as a wall in the insulating layer such as to demarcate a region including the functional device, the low potential terminal and the high potential terminal from another region in plan view, and is electrically separated from the semiconductor chip, the functional device, the low potential terminal and the high potential terminal.

Near-Field Antenna for Wireless Power Transmission with Antenna Elements that Follow Meandering Patterns
20230057092 · 2023-02-23 ·

A near-field antenna is provided, which includes: a first dipole antenna, formed along a first axis, having a first meandering shape and a second dipole antenna, formed along a second axis different from the first axis, having a second meandering shape. The antenna also includes (i) a power amplifier configured to feed electromagnetic signals to at least one of the first and second dipole antennas, (ii) an impedance-adjusting component configured to adjust an impedance of at least one of the first and second dipole antennas, and (iii) switch circuitry configured to switchably couple the first dipole antenna, the power amplifier, the second dipole antenna, and the impedance-adjusting component.

Magnetic integrated hybrid distribution transformer

A magnetic integrated hybrid distribution transformer includes a main transformer, a series isolation transformer and a converter, wherein: an iron core includes an iron beam unit, an iron yoke unit and a leakage magnetic core unit. The main transformer includes secondary windings, primary windings and control windings all of which are layer-windings and wound around main transformer iron beams. The series isolation transformer includes converter side windings and grid side windings all of which are pancake-windings and wound around isolation transformer iron beams. The converter side windings and the control windings are respectively connected with the converter by the star connection with neutral point. Leakage magnetic cores are respectively inserted between the primary windings and the control windings or between the converter side windings and the grid side windings, so as to achieve magnetic integration design of the transformer and output connection inductor of the converter.

INSULATING ELEMENT

An insulating element includes a first coil; a second coil; and an inter-layer insulating film located between the first coil and the second coil. The inter-layer insulating film includes a first layer, a second layer, and a third layer located between the first layer and the second layer. The first layer is located between the first coil and the third layer. The second layer is located between the second coil and the third layer. A bandgap of the third layer is narrower than a bandgap of the first layer and a bandgap of the second layer.

Multilayer coil component
11587720 · 2023-02-21 · ·

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and first and second outer electrodes that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively extend along and cover at least parts of first and second end surfaces and parts of a first main surface. A stacking direction of the multilayer body and a coil axis direction of the coil are parallel to the first main surface. A low-dielectric-constant layer having a smaller relative dielectric constant than the insulating layers is provided between the multilayer body and the part of the first outer electrode that extends along the first main surface.

Winding-type coil component and direct-current superimposing circuit using the same

A direct-current superimposing circuit includes differential signal lines, capacitors, a common mode choke coil, a winding-type coil component, and a DC power supply which are disposed at a circuit board. The winding-type coil component includes a core, two pairs of terminal electrodes, and two windings (a first winding and a second winding). On the end surface of a flange portion, the terminal electrodes in one of the two pairs and the terminal electrodes in the other one of the two pairs are placed to face each other across the winding center of a winding core. The winding start and winding end of the first winding are connected to the terminal electrodes in one of the two pairs. The winding start and winding end of the second winding are connected to the terminal electrodes in the other one of the two pairs.