A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.

An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.

A magnetic film assembly includes a coil having a plurality of turns defining a first major boundary surface of the coil, such that when energized, the coil generates an in-plane magnetic field component in a region of interest in air proximate and substantially parallel to the first major boundary surface, the in-plane magnetic field component having a magnetic field strength H that varies between a maximum Hmax and about 10% of Hmax in the region of interest in air; and a magnetic layer disposed on the coil so as to include the region of interest, such that when energized, the coil generates a magnetic field inducing an in-plane magnetic flux density B in the magnetic layer in the region of interest that varies less than about 5% in the region of interest.

A magnetic inlay includes a magnetic matrix and a plurality of electrically conductive vertical through connections extending vertically through the magnetic matrix. Further, a component carrier including the magnetic inlay and a method of manufacturing said magnetic inlay are described.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace and the second sub-trace form a plurality of first wires together at a first side of the inductor device, and form a plurality of second wires together at a second side of the inductor device. The second sub-trace is coupled to one terminal of the first sub-trace at a first node. The third sub-trace and the fourth sub-trace form a plurality of third wires together at the first side of the inductor device, and form a plurality of fourth wires together at the second side of the inductor device. The fourth sub-trace is coupled to one terminal of the third sub-trace at a second node. The capacitor is coupled to the first node and the second node.

A method for fabricating an electrical or electronic device package includes providing a first plateable encapsulation layer; activating first selective areas on a main surface of the first plateable encapsulation layer; forming a first metallization layer by electrolytic or electroless plating on the first activated areas; and fabricating a passive electrical component on the basis of the first metallization layer.

Disclosed herein is a coil component that includes a first coil, and a second coil disposed so as to surround the first coil. The first coil includes a first section extending in a first direction, a second section extending in a second direction orthogonal to the first direction, and a third section positioned between the first and second sections. Gaps between the first, second, and third sections of the first coil and the second coil as viewed in a coil axis direction have a first width, a second width, and a third width, respectively. The second width is larger than the first width and smaller than the third width.

Systems, methods and apparatus for wireless charging are disclosed. A wireless charging device has a plurality of planar power transmitting coils, a driver circuit and at least one substrate having channels formed therein. The channels can receive a flow of air at a port of entry and conduct the flow of air through the substrate to a port of exit. The planar power transmitting coils may be supported by at least one substrate. Each planar power transmitting coil may be formed as a spiral winding surrounding a power transfer area. The driver circuit may be configured to provide a charging current to one or more of the planar power transmitting coils when a chargeable device is placed on or near the wireless charging device. The one or more channels may be configured to conduct the flow of air past or through the planar power transmitting coils and the driver circuit.

A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.