Patent classifications
H01F27/2804
On-chip multi-layer transformer and inductor
A stacked transformer or inductor apparatus including a first layer with a first layer wire element extending around a center axis and a second layer with a second layer wire element. The second layer element includes side by side first and second wire components in parallel spaced relation extending around the center axis and the first wire component is connected to the first layer wire element to form a primary turn winding. A third layer includes a third layer wire element extending around the center axis and connected to the second wire component of the second layer wire element to form a secondary turn winding partially overlapping with the primary turn winding.
Coil array component
A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.
Systems and methods of fabricating coils for coreless transformers and inductors
The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.
Inductor device
An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.
Laminate Transformer with Overlapping Lead Frame
An apparatus has a laminate substrate that has a first surface and an opposite second surface. A laminate transformer is located within the laminate substrate between the first surface and the second surface. The transformer has a first coil adjacent the first surface and a second coil adjacent the second surface. A magnetic core element on the first surface overlaps a portion of the first coil. A lead frame on the first surface is spaced apart from the magnetic core element. A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path.
SYSTEMS AND METHODS FOR IMPROVING WINDING LOSSES IN PLANAR TRANSFORMERS
Systems and methods for improving winding losses in transformers. In one aspect, a transformer includes a first magnetic core having a first portion in contact with a second magnetic core and a second portion separated from the second magnetic core by a distance d, a plurality of primary windings formed around the second portion, a first secondary winding forming a first layer having a first inner diameter, a second secondary winding forming an n.sup.th layer having a second inner diameter. The plurality of primary windings are positioned between the first layer and the n.sup.th layer, where the plurality of primary windings, and the first secondary winding and the second secondary winding are formed around the second portion, and a difference between the first inner diameter and the second inner diameter defines a distance y, and a ratio of distance y to distance d is between 0.01 to 10.
HIGH FREQUENCY INTEGRATED PLANAR MAGNETICS FOR A BIDIRECTIONAL AC TO DC CLLC RESONANT CONVERTER
A transformer for a power converter, comprising: a first auxiliary subcore, a central subcore, and a second auxiliary subcore, each respective subcore comprising a lower plate, at least one pair of central spacers, and an upper plate, the lower plate, at least one pair of central spacers, and the upper plate of each subcore, being respectively separated by a gap; the first auxiliary subcore and the central subcore being separated by a gap; the second auxiliary subcore and the central subcore being separated by a gap; a primary coil, encircling a first spacer of the first auxiliary subcore and a first spacer of the central subcore; and a secondary coil, encircling a second spacer of the second auxiliary subcore and a second spacer of the central subcore.
Neel effect® isolated DC/AC current sensor incorporated in a PCB
A current sensor includes at least one primary circuit that is intended to conduct the current to be measured, and a secondary circuit containing at least four Neel-effect® transducers, each having a coil and a superparamagnetic core. The current sensor is designed on the basis of a printed circuit board, the primary circuit including at least two distinct metal tracks that are composed of one and the same metal and connected to one another by a via made of a rivet, of a tube or of an electrolytic deposit of the same metal.
Electronic component and electronic component module
An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.
Transformer, electromagnetic device and manufacturing method of the transformer
A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.