An inductor component includes a multilayer body including a magnetic layer; an inductor wiring disposed inside the multilayer body; and an external terminal exposed from the multilayer body. The multilayer body or the external terminal has an overlapping region disposed on the inductor wiring and a non-overlapping region not in contact with the inductor wiring, and reflection spectra of the overlapping region is different from reflection spectra of the non-overlapping region when irradiated with light having a prescribed wavelength from an outer surface side.

A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.

A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

A winding unit for connecting to a high-voltage grid or network includes a winding embedded in a solid insulating body and a first main connection terminal connected to a first winding end of the winding and disposed on a first support formed on the insulating body. A second main connection terminal is connected to a second winding end of the winding. The winding has partial windings and taps for adjusting the number of windings of the partial windings connected in series. Outgoing lines extending in the insulating body connect the taps to a tap connection terminal accessible from the outside. The tap connection terminals are formed on the support in order to encapsulate the higher voltage in a resin block over the entire periphery by using a shielding cage.

A winding unit for connecting to a high-voltage grid or network includes a winding embedded in a solid insulating body and a first main connection terminal connected to a first winding end of the winding and disposed on a first support formed on the insulating body. A second main connection terminal is connected to a second winding end of the winding. The winding has partial windings and taps for adjusting the number of windings of the partial windings connected in series. Outgoing lines extending in the insulating body connect the taps to a tap connection terminal accessible from the outside. The tap connection terminals are formed on the support in order to encapsulate the higher voltage in a resin block over the entire periphery by using a shielding cage.

A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors stacked in the length direction together with the insulating layers. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. The first outer electrode has first, second, and third electrode portions. As viewed in plan in the width direction, the third electrode portion is substantially concave toward a vertex where first and second edges meet, the first edge being an edge where the first and third electrode portions meet, the second edge being an edge where the second and third electrode portions meet.

A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors stacked in the length direction together with the insulating layers. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. The first outer electrode has first, second, and third electrode portions. As viewed in plan in the width direction, the third electrode portion is substantially concave toward a vertex where first and second edges meet, the first edge being an edge where the first and third electrode portions meet, the second edge being an edge where the second and third electrode portions meet.

Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.