A sintered material contains Fe in an amount of from 8 mol % to 37 mol % in terms of Fe.sub.2O.sub.3, Zn in an amount of from 30 mol % to 60 mol % in terms of ZnO, Cu in an amount of from 1 mol % to 7 mol % in terms of CuO, Ni in an amount of from 3 mol % to 17 mol % in terms of NiO, and Si in an amount of from 7 mol % to 28 mol % in terms of SiO.sub.2. A mole ratio (SiO.sub.2/Fe.sub.2O.sub.3) of the SiO.sub.2 to the Fe.sub.2O.sub.3 is from 0.2 to 3.5. The sintered material contains B in an amount of from 0.05 mol parts to 0.5 mol parts.

An electronics assembly includes a plurality of planar conductive metal sheets including a first conductive metal sheet, a second conductive metal sheet attached and electrically coupled to the first metal sheet, and a third conductive metal sheet attached and electrically coupled to the second metal sheet. The second metal sheet is located between the first and third conductive metal sheets. Air gaps are defined in the plurality of planar conductive metal sheets to form metal traces that define electrically isolated conductive paths from an outer surface of the first conductive metal sheet to an outer surface of the third conductive metal sheet in a multilevel conductive wiring network. The multilevel conductive wiring network can be attached and electrically coupled to a microchip and to one or more capacitors to form a power converter.

A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

The present invention relates to the use, for the retrofilling of a transformer, of at least one dielectric fluid of general formula (1):

(A−X).sub.n−B  (1)

in which A and B, which are identical or different, represent, independently of each other, an optionally substituted aromatic ring, X represents a spacer group and n represents 0, 1, 2 or 3.

The invention also relates to a transformer containing at least one dielectric fluid of general formula (1) and an amount of PCBs of less than 20%.

The invention comprises a method for manufacturing an inductor, comprising the steps of: casting a first cast winding section; casting a second cast winding section; and mechanically coupling the first cast winding section to the second cast winding section to form a section of a winding about a core of the inductor. Optionally, a first end of a connector section is welded to the first cast winding section and a second end of the connector section is welded to the second cast winding section, where the first and second cast winding sections have a common cast shape.

There are provided a wire wound inductor and a manufacturing method thereof according to an exemplary embodiment in the present disclosure. The wire wound inductor according to an exemplary embodiment in the present disclosure includes a winding coil, a magnetic core embedding the winding coil, and an adhesive portion disposed between the magnetic core and the winding coil and enclosing the winding coil.

A reactor includes a coil including a wire that is covered with an insulating film and is wound, the coil including a first lateral surface and a second lateral surface different from the first lateral surface; a cooler that faces the first lateral surface; and an insulating heat radiation layer that is sandwiched between the first lateral surface and the cooler. In the first lateral surface, the wire is not covered with the insulating film. In the second lateral surface, the wire is covered with the insulating film. A degree of flatness of the first lateral surface is lower than a degree of flatness of the second lateral surface.