A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

A coil device includes a bobbin including a hollow cylindrical portion and first and second flanges disposed at ends of the hollow cylindrical portion, and having a first partition located between the first and second flange and a second partition located between the first partition and second flange; the first winding wound around the outer periphery of the hollow cylindrical portion between first partition and the first flange; the second winding wound around the outer peripheral surface of the hollow cylindrical portion between the first partition and the second flange, and wound around both sides of the second partition according to a predetermined position. The coil device can wind the winding wire of the second winding at a predetermined position, thereby reinforcing the secondary side magnetic coupling while controlling or reducing the leakage inductance manufacturing error between the primary and secondary side due to difference in the secondary side winding.

A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

In an embodiment a coil element includes a first core element and a first winding body arranged around a winding carrier part of the first core element with a winding axis, wherein the first winding body includes a first film conductor element and the first film conductor element includes a plurality of conductor films stacked on top of each other along a stacking direction and arranged electrically insulated from each other, wherein the stacking direction is parallel to the winding axis, and wherein the first core element includes a plurality of windings of the first film conductor element arranged in a spiral around the winding axis.

A thin film inductor is provided. The thin film inductor includes a first coil assembly, a first magnetic layer, and a second magnetic layer. The first coil assembly includes a first substrate and two first electrically conductive circuits respectively arranged on two surfaces of the first substrate that are opposite to each other. The first magnetic layer and the second magnetic layer are respectively arranged on the two surfaces of the first substrate that are opposite to each other, and the two first electrically conductive circuits are respectively embedded in the first magnetic layer and the second magnetic layer. The first substrate has a first non-circuit layout, and the first electrically conductive circuit is arranged around the first non-circuit layout. A ratio between an area of the first non-circuit layout and an area of the first substrate is 0.1 or more.

A coil component includes a body having first to fourth side surfaces, a coil disposed in the body, and an insulating member disposed on at least one of the first to fourth side surfaces of the body and including first to third insulating layers. The insulating member may include first and second insulating members respectively disposed on the third and fourth side surfaces.

The invention comprises a method, including the steps of: providing an inductor core and longitudinally joining a first electrical turn section to a second electrical turn section to form at least part of an electrical turn of a winding about the inductor core and optionally including at least one of the steps of: (1) additive manufacturing, casting, stamping from metal stock, cutting material, and/or bending metal to form the first electrical turn section and/or (2) welding and/or mechanically joining the first electrical turn section to the second electrical turn section.

The present disclosure relates to electrical windings for a dry transformer which allows construction of a compact dry transformer even in relatively high voltage classes. For this purpose, the electrical winding has multiple windings of a winding conductor wound to form a coil. The coil has been embedded into a solid insulation body. In some embodiments, a coating of an electrically conductive material, comprising a resin matrix with at least 0.05% by weight of nanoscale filler, has been applied to at least one surface of the insulation body.

An electronic component includes: an insulator part (10) of rectangular solid shape; a coil element (32) provided inside the insulator part (10); bottom electrodes (40) provided on a bottom face (14) of the insulator part (10) and electrically connected to the coil element (32); a plating layer (62) provided in a manner overlapping each bottom electrode (40) so that its end (64) on the bottom face (14) is away from the end (42) of the bottom electrode (40); a plating layer (60) which is arranged between the bottom electrode (40) and the plating layer (62) and overlaps the bottom electrode (40), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (62); and an insulation layer (70) provided on the bottom face (14) in a manner covering the end (42) of the bottom electrode (40).