A coil device includes a bobbin including a hollow cylindrical portion and first and second flanges disposed at ends of the hollow cylindrical portion, and having a first partition located between the first and second flange and a second partition located between the first partition and second flange; the first winding wound around the outer periphery of the hollow cylindrical portion between first partition and the first flange; the second winding wound around the outer peripheral surface of the hollow cylindrical portion between the first partition and the second flange, and wound around both sides of the second partition according to a predetermined position. The coil device can wind the winding wire of the second winding at a predetermined position, thereby reinforcing the secondary side magnetic coupling while controlling or reducing the leakage inductance manufacturing error between the primary and secondary side due to difference in the secondary side winding.

A coil device includes a bobbin including a hollow cylindrical portion and first and second flanges disposed at ends of the hollow cylindrical portion, and having a first partition located between the first and second flange and a second partition located between the first partition and second flange; the first winding wound around the outer periphery of the hollow cylindrical portion between first partition and the first flange; the second winding wound around the outer peripheral surface of the hollow cylindrical portion between the first partition and the second flange, and wound around both sides of the second partition according to a predetermined position. The coil device can wind the winding wire of the second winding at a predetermined position, thereby reinforcing the secondary side magnetic coupling while controlling or reducing the leakage inductance manufacturing error between the primary and secondary side due to difference in the secondary side winding.

The superconducting coil includes: a winding frame; and at least two superconducting rectangular wire layers provided in such a manner that a superconducting rectangular wire is spirally wound on an outer surface of the frame such that wires adjacent to each other in an axial direction of the frame are arranged side by side and separated, the wire including an NbTi-based or Nb.sub.3Sn-based wire having a surface coated with copper or copper alloy, in which at least a thermoplastic fusible resin is provided in a separated section between the adjacent wires, and when viewed in a cross section including an axis of the frame, at least one of voids that are partitionable on outer surfaces of a total of three wires and a total of four wires located on the two adjacent layers and adjacent to each other are 4% or less in terms of a void ratio (V1).

Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.

Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.

Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.

Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

A system includes a magnetic material supply for regulating a magnetic material flow rate of a magnetic material and a binder material supply for regulating a binder material flow rate of a binder material. A nozzle is configured for depositing a deposition mixture of the magnetic material and the binder material on a surface and a preheater is configured to preheat the deposition mixture before depositing on the surface. A controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater. The controller is configured to receive an inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core, move the nozzle to one or more deposition locations, and adjust the magnetic material flow rate to the binder material flow rate to achieve a deposition mixture having a desired magnetic permeability at the deposition locations.

The present disclosure relates to semiconductor structures and, more particularly, to series inductors and methods of manufacture. A structure includes a plurality of wiring levels each of which include a wiring structure connected in series to one another. A second wiring level being located above a first wiring level of the plurality of wiring levels. A wiring structure on the second wiring level being at least partially outside boundaries of the wiring structure of the first wiring level.

Various embodiments of the present disclosure relate to power conversion using a planar transformer assembly that provides medium-voltage isolation at high frequencies. A planar transformer comprises primary and secondary planar windings configured to generate an isolated output. Each primary and secondary winding is interleaved on layers of a printed circuit board using one or more vias within the layers of the printed circuit board. The planar transformer also comprises a magnetic core and a field-shaping apparatus coupled with the printed circuit board. The field-shaping apparatus is configured to shape an electric field generated by the windings. The primary windings can be coupled to a DC source via switching devices while the secondary windings can be coupled via switching devices to one or more DC ports followed by AC inverters configured to generate three single-phase AC outputs for medium voltage applications.