The present disclosure relates to an electronic component and a method for manufacturing the same, and more particularly, to a surface mounting type electronic component provided on an electronic device and a method for manufacturing the same.

An electronic component in accordance with an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed as at least a portion of a plurality of edges at which two mutually adjacent surfaces meet is recessed, an insulation part provided on a surface of the main body part to cover the recessed portion, and an electrode part separately provided on the surface of the main body part except for an area on which the insulation part is provided.

The present disclosure relates to an electronic component and a method for manufacturing the same, and more particularly, to a surface mounting type electronic component provided on an electronic device and a method for manufacturing the same.

An electronic component in accordance with an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed as at least a portion of a plurality of edges at which two mutually adjacent surfaces meet is recessed, an insulation part provided on a surface of the main body part to cover the recessed portion, and an electrode part separately provided on the surface of the main body part except for an area on which the insulation part is provided.

The present invention provides a magnetic element, a method for manufacturing the same and a substrate. The magnetic element includes: a first wiring region including a first conductive layer and a second conductive layer which are arranged along a first direction; a second wiring region including a third conductive layer and a fourth conductive layer which are arranged along a second direction perpendicular to the first direction and are disposed in opposite sides of the second wiring region, respectively; an accommodating space disposed between the third conductive layer and the fourth conductive layer, wherein the second conductive layer is disposed on one side of the first conductive layer away from the accommodating space; and a magnetic column disposed within the accommodating space, wherein the third conductive layer includes a first wiring region directly connected to the first conductive layer, to form a part of windings of the magnetic element.

A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A manufacturing method of a reactor includes: a coil mold step of forming a coil mold in which a first resin is molded to cover at least part of a coil; and a main body mold step of forming a main body mold in which a second resin is molded to cover at least part of an assembly body in which the coil, the coil mold, two I-cores, and an O-core surrounding the coil and the coil mold are assembled. In the coil mold step, a gap plate configured to fill a gap between positions where the two I-cores are placed is formed by molding with the first resin. In the main body mold step, gap plates each configured to fill a gap between the O-core and a corresponding one of the I-cores are formed by molding with the second resin.

A manufacturing method of a reactor includes: a coil mold step of forming a coil mold in which a first resin is molded to cover at least part of a coil; and a main body mold step of forming a main body mold in which a second resin is molded to cover at least part of an assembly body in which the coil, the coil mold, two I-cores, and an O-core surrounding the coil and the coil mold are assembled. In the coil mold step, a gap plate configured to fill a gap between positions where the two I-cores are placed is formed by molding with the first resin. In the main body mold step, gap plates each configured to fill a gap between the O-core and a corresponding one of the I-cores are formed by molding with the second resin.