Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.

Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.

A system and method for an additive platform for a wire-wound power transmission construct includes: a wire, comprising an interior metal core, and an adhesive coating; a wire plotting platform, that shapes and deposits the wire in a moving region of wire deposition and a bonding module, comprising components that fix the wire into place. The wire plotting platform may comprise a wire deposition component and a positioning component that includes an actuation system with at least two degrees of freedom. The bonding module may comprise a mechanism that activates the adhesive coating such that the wire anneals to itself, or to other components, in the region of wire deposition concurrent to deposition of the wire by the wire plotting platform. The system functions as a high-speed high-precision additive manufacturing device, wherein the device is suited for the construction of wire-wound power transmission devices.

A system and method for an additive platform for a wire-wound power transmission construct includes: a wire, comprising an interior metal core, and an adhesive coating; a wire plotting platform, that shapes and deposits the wire in a moving region of wire deposition and a bonding module, comprising components that fix the wire into place. The wire plotting platform may comprise a wire deposition component and a positioning component that includes an actuation system with at least two degrees of freedom. The bonding module may comprise a mechanism that activates the adhesive coating such that the wire anneals to itself, or to other components, in the region of wire deposition concurrent to deposition of the wire by the wire plotting platform. The system functions as a high-speed high-precision additive manufacturing device, wherein the device is suited for the construction of wire-wound power transmission devices.

The invention comprises a method for manufacturing an inductor, comprising the steps of: casting a first cast winding section; casting a second cast winding section; and mechanically coupling the first cast winding section to the second cast winding section to form a section of a winding about a core of the inductor. Optionally, a first end of a connector section is welded to the first cast winding section and a second end of the connector section is welded to the second cast winding section, where the first and second cast winding sections have a common cast shape.

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

A reactor includes a coil including a wire that is covered with an insulating film and is wound, the coil including a first lateral surface and a second lateral surface different from the first lateral surface; a cooler that faces the first lateral surface; and an insulating heat radiation layer that is sandwiched between the first lateral surface and the cooler. In the first lateral surface, the wire is not covered with the insulating film. In the second lateral surface, the wire is covered with the insulating film. A degree of flatness of the first lateral surface is lower than a degree of flatness of the second lateral surface.

A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.