When a slurry 41 obtained by dispersing a rare-earth-compound powder in a solvent is applied to sintered magnet bodies 1, and dried to remove the solvent in the slurry and cause the surfaces of the sintered magnet bodies to be coated with the powder, and the sintered magnet bodies coated with the powder are heat treated to cause the rare-earth element to be absorbed by the sintered magnet bodies, the sintered magnet bodies having had the slurry applied thereto are dried by being irradiated with near infrared radiation having a wavelength of 0.8-5 m, to remove the solvent in the slurry, and cause the surfaces of the sintered magnet bodies to be coated with the powder. As a result, the rare-earth-compound powder can be uniformly and efficiently applied to the surfaces of the sintered magnet bodies.

A method of producing an oppositely magnetized magnetic structure within or on a substrate material includes: First and second numbers of cavities are generated within or on a substrate material and are filled with first and second hard magnetic materials, respectively, exhibiting first and second coercive field strengths, respectively, so as to produce first and second arrangements of hard magnetic structures, respectively, the second coercive field strength being smaller than the first coercive field strength.

The first and second arrangements of hard magnetic structures are magnetized in a first direction by a first magnetic field exhibiting a field strength which exceeds the first and second coercive field strengths.

The second arrangement of hard magnetic structures is magnetized in a second direction, which differs from the first direction, by a second magnetic field exhibiting a field strength which falls below the first coercive field strength but exceeds the second coercive field strength. Magnetizing the second arrangement of hard magnetic structures includes exposing the first and second arrangements of hard magnetic structures to the second magnetic field.

A method of producing an oppositely magnetized magnetic structure within or on a substrate material includes: First and second numbers of cavities are generated within or on a substrate material and are filled with first and second hard magnetic materials, respectively, exhibiting first and second coercive field strengths, respectively, so as to produce first and second arrangements of hard magnetic structures, respectively, the second coercive field strength being smaller than the first coercive field strength.

The first and second arrangements of hard magnetic structures are magnetized in a first direction by a first magnetic field exhibiting a field strength which exceeds the first and second coercive field strengths.

The second arrangement of hard magnetic structures is magnetized in a second direction, which differs from the first direction, by a second magnetic field exhibiting a field strength which falls below the first coercive field strength but exceeds the second coercive field strength. Magnetizing the second arrangement of hard magnetic structures includes exposing the first and second arrangements of hard magnetic structures to the second magnetic field.

A method for forming self aligned magnetic memory element pillars for Magnetic Random Access Memory. The method allows the magnetic memory element pillars to be arranged in staggered rows of memory elements at a pitch that is smaller than what is possible using photolithography alone. The method involves forming a spacer mask in the form of an array of connected rings arranged in a square pattern of non-staggered rows. A sacrificial mask material is deposited over the spacer mask and the spacer mask is then removed, leaving sacrificial mask material in the holes at the center of the rings and also in the spaces between the rings. A reactive ion processes is then performed to transfer the pattern of the sacrificial mask onto underlying hard mask layers. A material removal process can then be performed to define a plurality of memory element pillars.

A method for forming self aligned magnetic memory element pillars for Magnetic Random Access Memory. The method allows the magnetic memory element pillars to be arranged in staggered rows of memory elements at a pitch that is smaller than what is possible using photolithography alone. The method involves forming a spacer mask in the form of an array of connected rings arranged in a square pattern of non-staggered rows. A sacrificial mask material is deposited over the spacer mask and the spacer mask is then removed, leaving sacrificial mask material in the holes at the center of the rings and also in the spaces between the rings. A reactive ion processes is then performed to transfer the pattern of the sacrificial mask onto underlying hard mask layers. A material removal process can then be performed to define a plurality of memory element pillars.

An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.

An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.

A device and to a method of producing a device, wherein the method includes, inter alia, providing a substrate and generating at least two mutually spaced-apart cavities within the substrate. In accordance with the invention, each cavity has a depth of at least 50 m. The cavities are filled up with magnetic particles, wherein the magnetic particles enter into contact with one another at points of contact, and wherein cavities are formed between the points of contact. At least some of the magnetic particles are connected to one another at their points of contact, specifically by coating the magnetic particles, wherein the cavities are at least partly penetrated by the layer produced in the coating process, so that the connected magnetic particles form a magnetic porous structure.

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.