An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.

A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.

A method for designing a magnetic plate allowing magnetic particles contained in magnetic ink distributed at different densities includes estimating a distribution of the magnetic particles allowing the magnetic ink to be spread, estimating forms of magnetic field applying the magnetic force to the magnetic particles in order for the magnetic ink to be spread in a desired magnetic printing pattern within the printing layer, obtaining adjustment factors of the magnetic plate corresponding to the estimated forms of the magnetic field by using a model for which deep learning or machine learning has been performed using design conditions including at least one of an upper surface structure of the magnetic plate and a magnetization property of the magnetic plate and obtaining a parameter for the magnetic plate configured to form the magnetic printing pattern based on the obtained adjustment factors.

A method for designing a magnetic plate allowing magnetic particles contained in magnetic ink distributed at different densities includes estimating a distribution of the magnetic particles allowing the magnetic ink to be spread, estimating forms of magnetic field applying the magnetic force to the magnetic particles in order for the magnetic ink to be spread in a desired magnetic printing pattern within the printing layer, obtaining adjustment factors of the magnetic plate corresponding to the estimated forms of the magnetic field by using a model for which deep learning or machine learning has been performed using design conditions including at least one of an upper surface structure of the magnetic plate and a magnetization property of the magnetic plate and obtaining a parameter for the magnetic plate configured to form the magnetic printing pattern based on the obtained adjustment factors.

The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.

The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.

An electronic device includes a substrate; a porous semiconductor material layer arranged on the substrate; a first high magnetic permeability material arranged inside the pores of a first portion of the porous semiconductor layer, the first portion of the porous semiconductor material layer impregnated with the first high magnetic permeability material forming a first magnetic layer separated from the substrate by a second portion of the porous semiconductor material layer; and a coil arranged on the first magnetic layer.