Patent classifications
H01F41/24
Integrated electronic device comprising a coil and method for manufacturing such a device
An electronic device includes a substrate; a porous semiconductor material layer arranged on the substrate; a first high magnetic permeability material arranged inside the pores of a first portion of the porous semiconductor layer, the first portion of the porous semiconductor material layer impregnated with the first high magnetic permeability material forming a first magnetic layer separated from the substrate by a second portion of the porous semiconductor material layer; and a coil arranged on the first magnetic layer.
Additive deposition low temperature curable magnetic interconnecting layer for power components integration
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
Additive deposition low temperature curable magnetic interconnecting layer for power components integration
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTING LAYER FOR POWER COMPONENTS INTEGRATION
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTING LAYER FOR POWER COMPONENTS INTEGRATION
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
MAGNETIC SURFACES AND USES THEREOF
Modified surfaces of the present disclosure include a surface or substrate material, a magnetic field, which may be generated through the use of a magnet placed at a distance beneath the surface or substrate, or placed above the surface or substrate, or through the use of a magnetic surface or substrate, and a magnetic fluid, such as quereferrofluid or ferrogel, deposited in a layer on the top of the surface or substrate. The modified surfaces may be icephobic. In addition, a droplet of liquid placed on the modified surface can be manipulated through placement of a local heat source in proximity to the droplet, without contacting the droplet.
MAGNETIC SURFACES AND USES THEREOF
Modified surfaces of the present disclosure include a surface or substrate material, a magnetic field, which may be generated through the use of a magnet placed at a distance beneath the surface or substrate, or placed above the surface or substrate, or through the use of a magnetic surface or substrate, and a magnetic fluid, such as quereferrofluid or ferrogel, deposited in a layer on the top of the surface or substrate. The modified surfaces may be icephobic. In addition, a droplet of liquid placed on the modified surface can be manipulated through placement of a local heat source in proximity to the droplet, without contacting the droplet.
Method for Manufacturing a Functionalized Magnetic Particle
The present invention relates to a method for manufacturing a functionalized magnetic particle comprising the steps of: a) mixing an aqueous solution comprising a magnetic microparticle having a silica based surface with an aqueous solution of at least one metal salt to obtain a dispersion; and b) mixing the dispersion with a solution of sodium hydroxide, wherein the mixing is performed by simultaneously pumping the dispersion and the solution of sodium hydroxide through a static mixer, wherein the static mixer has a cylindrical design, a length of at least 320 mm and an inner diameter of at least 11 mm. The present invention further relates to a particle for recovering an anion from an aqueous solution obtainable by the method of the invention. The present invention further relates to various uses of the particle of the invention.
Method for Manufacturing a Functionalized Magnetic Particle
The present invention relates to a method for manufacturing a functionalized magnetic particle comprising the steps of: a) mixing an aqueous solution comprising a magnetic microparticle having a silica based surface with an aqueous solution of at least one metal salt to obtain a dispersion; and b) mixing the dispersion with a solution of sodium hydroxide, wherein the mixing is performed by simultaneously pumping the dispersion and the solution of sodium hydroxide through a static mixer, wherein the static mixer has a cylindrical design, a length of at least 320 mm and an inner diameter of at least 11 mm. The present invention further relates to a particle for recovering an anion from an aqueous solution obtainable by the method of the invention. The present invention further relates to various uses of the particle of the invention.
SEMICONDUCTOR PACKAGE SUBSTRATE WITH THROUGH-HOLE MAGNETIC CORE INDUCTOR USING CONDUCTIVE PASTE
The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.