A capacitor includes a capacitor element, a first electrode, a second electrode, a first bus bar, a second bus bar, an exterior member, and a filler resin. The first electrode is disposed on an end face of the capacitor element. The second electrode is disposed on another end face of the capacitor element. The first bus bar is connected to the first electrode. The second bus bar is connected to the second electrode. The exterior member covers the capacitor element. The filler resin fills an interior of the exterior member. The exterior member includes a metal laminate film and has an opening to lead out a part of the first bus bar and a part of the second bus bar. The opening is sealed with the filler resin.

The present application provides a resin-molded capacitor such that heat generated by a capacitor element can be efficiently dissipated, and a power conversion device. The resin-molded capacitor includes a first bus bar and a second bus bar joined to a first capacitor electrode and a second capacitor electrode respectively of a capacitor element, an insulating member joined to at least one of the first capacitor electrode and the second capacitor electrode or at least one of the first bus bar and the second bus bar, and an electrically conductive member joined to the insulating member.

An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.

An electronic device includes at least two chip components, a hold member with insulation, a first conductive terminal piece, a second conductive terminal piece, and an intermediate connection piece. The hold member holds the chip components side by side. The intermediate connection piece connects the terminal electrode of one of the chip components and the terminal electrode of the other chip component.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

The invention relates to a capacitive block, notably for an electrical equipment, comprising a case, a capacitive element housed in the case, a substance filling the space between the case and the capacitive element so as to ensure leak tightness of the capacitive element, a heat sink against which the capacitive element is in direct contact. In the capacitive block, the heat sink is different from the filling substance, a face of said heat sink, designated free face, forming an outer face of the capacitive block and being devoid of said filling substance.

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

A feed-through through a housing part of a housing, for example of a battery or a capacitor made of a metal, wherein the housing part has at least one opening, through which at least one conductor is fed in a glass or glass ceramic material, and wherein the conductor has at least two sections in the axial direction, a first section made of a first material, e.g. aluminium, and a second section made of a second material, e.g. copper, as well as a transition from the first to the second material, and wherein the transition from the first to the second material is located in the region of the glass or glass ceramic material, said glass or glass ceramic material being adapted to the metal of the housing in such a way that a compression glass-to-metal seal is formed.