A capacitive element is provided that includes a substrate, a lower electrode on the substrate, first upper electrodes disposed to face the lower electrode, second upper electrodes disposed to face the lower electrode, a dielectric layer disposed between the lower electrode and the first upper electrodes and between the lower electrode and the second upper electrodes, a first wiring conductor that connects the first upper electrodes, and a second wiring conductor that connects the second upper electrodes. The first and second upper electrodes are adjacent to each other in a surface direction along the lower electrode and in an X-axis direction, and the first and second upper electrodes are adjacent to each other in the surface direction along the lower electrode and in a Y-axis direction.

A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.

Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.

A high voltage capacitor includes a pair of capacitors; a common conductor, and a pair of individual conductors. Each of the pair of capacitors includes an element body having a columnar shape with a first direction as an axial direction, and including a first side surface and a second side surface facing away each other in a second direction orthogonal to the first direction, a first electrode disposed on the first side surface and electrically connected to a corresponding individual conductor of the pair of individual conductors; and a second electrode disposed on the second side surface and electrically connected to the common conductor. The pair of capacitors is disposed in such a way that the first electrodes face each other in the second direction. The common conductor surrounds the pair of capacitors and the pair of individual conductors when viewed from the first direction.

A film capacitor includes a capacitor element, a first bus bar, and a second bus bar. The first bus bar includes a first electrode connecting part connected to the first electrode of the capacitor element at one end and a first connection terminal at another end. The second bus bar includes a second electrode connecting part connected to the second electrode of the capacitor element at one end and a second connection terminal at another end. The first bus bar includes a branch part that is branched from a position closer to the first electrode connecting part than the first connection terminal and extends toward the second electrode along a peripheral surface of the capacitor element. The second bus bar includes an overlapping part that overlaps at least a part of the branch part. The overlapping part is along the peripheral surface of the capacitor element.

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

An electricity storage module includes: an electricity storage element group formed by aligning multiple electricity storage elements; detection wires that have end portions on one side connected to the electricity storage elements and detect the states of the electricity storage elements; a detection wire connector that is connected to other end portions on a side opposite to that of the end portions on the one side of the detection wires that are connected to the electricity storage elements; a device connector that electrically connects the detection wires and an external device by fitting into the detection wire connector; and a cover that covers a surface on a side on which the detection wires of the electricity storage element group are disposed. The cover is provided with a fixing hole that fixes the detection wire connector and the device connector in a state of being fit together.

A motor driving device includes a housing unit, a capacitor module, and a driving module. The housing unit includes a first compartment and a second compartment. The capacitor module is detachably mounted in the first compartment and includes a first circuit board, at least one capacitor electrically connected to the first circuit board, and two first conducting members electrically connected to the first circuit board. The driving module is mounted in the second compartment and includes a second circuit board and two second conducting members that are electrically connected to the second circuit board and that are respectively, electrically and detachably connected to the first conducting members.

In a chip type capacitor formed by attaching a seat plate to a capacitor, generation of voids or cracks due to flux gas generated at the time of soldering is suppressed. When providing auxiliary terminals for increasing the soldering strength on a seat plate for chipping, which enables a lead same direction type capacitor to be surface mounted, a gas release groove, preferably formed as a slit to release flux gas generated at the time of soldering, is formed on each of the auxiliary terminals.

An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. Thereby, disconnection of the wires connected to the electronic component embedded in the resin molded body is less likely to occur.