A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

The present invention relates to an arrangement for fastening a capacitor cup within which a capacitor is accommodated. The arrangement is for fastening a capacitor cup onto an opening of a mid-plate, wherein the capacitor cup comprises a cylindrical body having an opening end and an opposite end. The arrangement comprises: a collar provided on an outer surface of the cylindrical body, closely around the opening end; at least one first engagement feature formed at the outer surface of the cylindrical body and adjacent to the collar; and, at least one second engagement feature, corresponding to the first engagement feature, formed at an edge of the opening of the mid-plate; wherein, an engagement between the first and second engagement features fastens the capacitor cup onto the opening of the mid-plate. This arrangement for fastening the capacitor cup according to the present invention eliminates additional fastening members or parts, and effectively creates and maintains an environmental seal between the electronics area and the environment.

The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.

A feedthrough assembly includes a housing part having at least two openings, respectively through which at least one conductor embedded in a glass or a glass ceramic material is fed. The conductor, in the region of a glazing area, has a substantially round cross section, and in a first and/or second region above and/or below the glazing area has a substantially rectangular cross section to form a part of a flat conductor having rectangular regions. The parts of the flat conductor arranged above and/or below the glazing area are joined adjacent to one another, resulting in a cumulative flat conductor having a rectangular common cross section with a total width expansion that extends over the at least two openings. The diameter of the openings is smaller than a width of the rectangular regions of the respective part of the flat conductor.

A battery includes a battery element, a housing body, and a valve device. The housing body houses the battery element. The valve device is in communication with the inside of the housing body. Heat-sealable resin layers face each other in a peripheral edge portion of the housing body. A joined edge portion in which the mutually facing heat-sealable resin layers are fused together is formed in the peripheral edge portion of the housing body. The valve device is configured to reduce an internal pressure of the housing body if the internal pressure is increased due to gas generated in the housing body. The valve device includes a first portion that is located on an outer side of an edge of the joined edge portion and a second portion that is sandwiched between the heat-sealable resin layers in the joined edge portion.

A battery includes a battery element, housing body, and valve device. The housing body has a laminate including a base material, barrier, and heat-sealable resin layers. The valve device is in communication with the housing body inside. A joined edge portion in which the mutually facing heat-sealable resin layers are fused together is formed in a housing body peripheral edge portion. The valve device includes first and second portions. A valve mechanism reduces the housing body internal pressure if it is increased due to gas generated in the housing body is formed in the first portion. An air passage guides gas generated in the housing body toward the valve mechanism is formed in the second portion. The first portion is located on a joined edge portion edge outer side. At least a portion of the second portion is sandwiched between the heat-sealable resin layers in the joined edge portion.

A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

The invention relates to a capacitive structure comprising: first and second components, at least one component comprising a plurality of capacitive layers of a dielectric, each layer arranged between electrodes of different polarity, wherein the first and second components are arranged in a stack separated by a stress reducing layer having a supporting structure with an open mesh in which air acts to reduce the transmissibility of cracks through the stress reducing layer.

In various examples, a feedthrough seal apparatus is configured to seal an opening in a device. The device includes a case surrounding an interior space, the case including the opening therein to allow access to the interior space from an exterior of the case. The feedthrough seal apparatus includes a plug disposed within the opening of the case. The plug is formed from at least one of a polymeric material and an adhesive material. The lead wire extends through the plug, such that a first end of the lead wire is disposed within the interior space of the case and a second end extends from the plug to the exterior of the case. The plug is configured to electrically insulate the lead wire from the case. Some examples include a method of making the feedthrough seal apparatus.