A battery includes a battery element, a housing body, and a valve device. The housing body houses the battery element. The valve device is in communication with the inside of the housing body. Heat-sealable resin layers face each other in a peripheral edge portion of the housing body. A joined edge portion in which the mutually facing heat-sealable resin layers are fused together is formed in the peripheral edge portion of the housing body. The valve device is configured to reduce an internal pressure of the housing body if the internal pressure is increased due to gas generated in the housing body. The valve device includes a first portion that is located on an outer side of an edge of the joined edge portion and a second portion that is sandwiched between the heat-sealable resin layers in the joined edge portion.

A battery includes a battery element, housing body, and valve device. The housing body has a laminate including a base material, barrier, and heat-sealable resin layers. The valve device is in communication with the housing body inside. A joined edge portion in which the mutually facing heat-sealable resin layers are fused together is formed in a housing body peripheral edge portion. The valve device includes first and second portions. A valve mechanism reduces the housing body internal pressure if it is increased due to gas generated in the housing body is formed in the first portion. An air passage guides gas generated in the housing body toward the valve mechanism is formed in the second portion. The first portion is located on a joined edge portion edge outer side. At least a portion of the second portion is sandwiched between the heat-sealable resin layers in the joined edge portion.

A feedthrough assembly includes a housing part having at least two openings, respectively through which at least one conductor embedded in a glass or a glass ceramic material is fed. The conductor, in the region of a glazing area, has a substantially round cross section, and in a first and/or second region above and/or below the glazing area has a substantially rectangular cross section to form a part of a flat conductor having rectangular regions. The parts of the flat conductor arranged above and/or below the glazing area are joined adjacent to one another, resulting in a cumulative flat conductor having a rectangular common cross section with a total width expansion that extends over the at least two openings. The diameter of the openings is smaller than a width of the rectangular regions of the respective part of the flat conductor.

A capacitive element is provided that includes a substrate, a lower electrode on the substrate, first upper electrodes disposed to face the lower electrode, second upper electrodes disposed to face the lower electrode, a dielectric layer disposed between the lower electrode and the first upper electrodes and between the lower electrode and the second upper electrodes, a first wiring conductor that connects the first upper electrodes, and a second wiring conductor that connects the second upper electrodes. The first and second upper electrodes are adjacent to each other in a surface direction along the lower electrode and in an X-axis direction, and the first and second upper electrodes are adjacent to each other in the surface direction along the lower electrode and in a Y-axis direction.

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals that support the carrier with respect to another electronic component or device such as a printed circuit board. Each connection terminal has a body portion that is electrically connected to one capacitor lead of the pair of capacitor leads at a connection location, and a device connection portion that protrudes from the carrier. Leads of the capacitor and the connection locations are encapsulated by wall structures of the carrier.

A carrier is configured to house a capacitor that includes a casing, a first capacitor lead that protrudes from the casing and a second capacitor lead that protrudes from the casing. The carrier includes a first container portion and a second container portion. The first container portion and the second container portion have the same shape and dimensions, and when assembled together, define an interior space that receives and retains the capacitor therein.

The present application provides a resin-molded capacitor such that heat generated by a capacitor element can be efficiently dissipated, and a power conversion device. The resin-molded capacitor includes a first bus bar and a second bus bar joined to a first capacitor electrode and a second capacitor electrode respectively of a capacitor element, an insulating member joined to at least one of the first capacitor electrode and the second capacitor electrode or at least one of the first bus bar and the second bus bar, and an electrically conductive member joined to the insulating member.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.