An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.

A semiconductor device, including a capacitor, a semiconductor module having a first power terminal formed on a front surface of a first insulating member, and a connecting member electrically connecting and mechanically coupling the semiconductor module and the capacitor to each other, the connecting member having a front surface and a rear surface opposite to each other, the rear surface being on a front surface of the first power terminal. The connecting member is bonded to the semiconductor module via a first welded portion, which penetrates the front and rear surfaces of the connecting member, and penetrates the front surface of the first power terminal, in a thickness direction of the semiconductor device, a distance in the thickness direction between a bottommost portion of first welded portion and the front surface of the first insulating member being 0.3 mm or more.

A DC link capacitor (8) comprises a capacitor housing, a plurality of capacitor cells (1), each comprising a film capacitor element (2) with a wound metallized film and two contact terminals (3a, 3b) connected to the metallized plastic film. The plurality of capacitor cells (1) are arranged in the capacitor housing (4) and are sealed therein by means of a sealing material (7). The contact terminals (3a, 3b) are electrically isolated from each other and protrude separately out of the sealing material (7), in order to be connected by means of bus bars.

A power semiconductor module has a substrate, with power semiconductor components, and a DC voltage connecting device, which has a first and a second flat conductor connecting element and at least one first metal layer connecting element and at least one second metal layer connecting element, wherein the second flat conductor connecting element is arranged spaced apart in the normal direction of the first flat conductor connecting element from the first flat conductor connecting element, the first flat conductor connecting element is electrically connected by the first metal layer connecting element and the second flat conductor connecting element is electrically connected by the second metal layer connecting element to the metal layer, the first flat conductor connecting element has a flat conductor end section and a flat conductor connection section arranged between the one first metal layer connecting element and the flat conductor end section.

A capacitor array that includes a plurality of solid electrolytic capacitor elements each of which has a first main surface and a second main surface facing each other in a thickness direction and includes an anode plate made of a valve action metal, a porous layer on at least one surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer on a surface of the dielectric layer and including a solid electrolyte layer; a first sealing layer in a sheet-like shape and covering the first main surface of the plurality of solid electrolytic capacitor elements; and a second sealing layer in a sheet-like shape and covering the second main surface of the plurality of solid electrolytic capacitor elements.

An electrical storage module includes an insulating substrate that opposes an electrical storage group including a plurality of electrical storage devices and includes a plurality of through-holes, a plurality of current collecting foils that are arranged side by side at intervals from each other on a first surface of the insulating substrate on a side opposite to a surface that opposes the electrical storage group, and an insulating sheet that is disposed to cover the plurality of current collecting foils. The plurality of current collecting foils include a first current collecting foil and a second current collecting foil that are adjacent to each other at an interval in a direction parallel to the first surface. The first current collecting foil includes a first lead part in a tongue shape that extends from an edge, is inserted into a hole of the insulating substrate, and is electrically connected to a positive electrode of a battery, and the second current collecting foil includes a second lead part in a tongue shape that extends from the edge, is inserted into the hole of the insulating substrate, and is electrically connected to a negative electrode of the battery.

An energy storage apparatus (1) includes an energy storage device (20), a plate-shaped first member (harness plate (50)) arranged above the energy storage device (20), and a second member (bus bar frame (30)) arranged below the first member. A first one of the first member and the second member has a first convex part (first convex part (32)) projecting toward a second one, and the second one of the first member and the second member has a first concave part or a through hole (through hole (53)) into which the first convex part is inserted, and a second convex part (second convex part (51)) projecting along periphery of the first convex part so as to surround the periphery of the first convex part.

Embodiments of present disclosure relate to a capacitor assembly and a dry-type capacitor. The capacitor assembly includes: a first layer of capacitor elements; a second layer of capacitor elements, wherein the first layer of capacitor elements is stacked on the second layer of capacitor elements; a first busbar comprising a first conductive plate provided with a plurality of holes, wherein the first conductive plate is electrically coupled to the capacitor elements of the first layer via a plurality of connecting elements arranged at the respective holes of the first conductive plate; and a second busbar electrically coupled to the first busbar and including a second conductive plate provided with a plurality of holes, wherein the second conductive plate is electrically coupled to the capacitor elements of the second layer via a plurality of connecting elements arranged at the respective holes of the second conductive plate.

A seat plate assembly for fixing a capacitor on a circuit board, including a base plate, a first guard plate, a second guard plate, a third guard plate, a fourth guard plate, a first reinforcing rib and a second reinforcing rib. The first guard plate, the second guard plate, the third guard plate and the fourth guard plate are provided spaced apart on an upper end surface of the base plate in sequence. The first reinforcing rib is configured to connect the first guard plate with the second guard plate. The second reinforcing rib is configured to connect the third guard plate with the fourth guard plate.

This invention provides a box for accommodating capacitor including bottom plate, two first side plates, two second side plates, fixed engagement structure and movable engagement structure. First side plates are disposed opposite to each other. Second side plates are disposed opposite to each other. Side plates are respectively connected to a plurality of side edges of bottom plate so that bottom plate and side plates together form accommodation space. Fixed engagement structure and the movable engagement structure are respectively connected to first side plates. Fixed engagement structure and movable engagement structure are located at a side of accommodation space that is located farthest from bottom plate. Movable engagement structure includes cantilever part and engagement part. Cantilever part is connected to one of first side plates. Engagement part protrudes from movable end part of cantilever part.