A capacitor, an assembly comprising a capacitor and a busbar and a method for manufacturing a capacitor are disclosed. In an embodiment a capacitor includes a winding element and a terminal having a first part of a first material and a second part of a second material, the second material being different than the first material, wherein the first part is electrically contacted to the winding element, and wherein the second part is an external contact of the capacitor.

A capacitor, an assembly comprising a capacitor and a busbar and a method for manufacturing a capacitor are disclosed. In an embodiment a capacitor includes a winding element and a terminal having a first part of a first material and a second part of a second material, the second material being different than the first material, wherein the first part is electrically contacted to the winding element, and wherein the second part is an external contact of the capacitor.

The disclosure provides a chemical reduction of a metal in a cable of an electrical network, which brings about an improvement in the conductive properties of said metal and a reduction in losses during electric power transmission. The invention discloses a reducing compound with a high concentration of quasi-free electrons, which is obtained as a result of the solvation of metals selected from group I and group II of the main group of the periodic table of elements and of amines selected from the group consisting of: pyridine, and dimethylformamide dispersed in a liquid oligomer, with a metal:amine:dielectric molar ratio of 1:2:1.5, allowing, in an alternating electromagnetic field, to initiate a pulsed injection of electrons into the network with a periodicity equal to frequency of alternation of the voltage.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.

A capacitor is disclosed. In an embodiment a capacitor includes a receptacle with an opening, at least one capacitor element disposed inside of the receptacle and a lid sealing the receptacle, wherein a vent is arranged in a recess in an inner surface of the lid.

A capacitor array that includes a plurality of solid electrolytic capacitor elements, a sheet-shaped first sealing layer, and a sheet-shaped second sealing layer. The plurality of solid electrolytic capacitor elements include an anode plate, a porous layer, a dielectric layer, and a cathode layer. Each of the solid electrolytic capacitor elements are partitioned from each other by a slit-shaped removal part and have a first main surface and a second main surface.