An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with

a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.

An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with

a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.

A capacitor (2) includes a capacitor main body (4), a base (6), and a resin layer (8-1). The capacitor main body includes an outer package case (10), an opening sealing member (14) attached to an opening of the outer package case, and a terminal lead (16-1, 16-2) extending through the opening sealing member. The base is disposed toward the opening sealing member of the capacitor main body and includes an insertion through hole (18-1, 18-2) into which the terminal lead is inserted to be exposed on a mounting surface side, and a protruding portion (20) surrounding the insertion through hole. The resin layer is arranged at least between the base and the opening sealing member. The base and the resin layer are in contact with or spaced apart from each other without at least partly adhering to each other.

A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.

A capacitor array that includes a plurality of solid electrolytic capacitor elements each of which has a first main surface and a second main surface facing each other in a thickness direction and includes an anode plate made of a valve action metal, a porous layer on at least one surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer on a surface of the dielectric layer and including a solid electrolyte layer; a first sealing layer in a sheet-like shape and covering the first main surface of the plurality of solid electrolytic capacitor elements; and a second sealing layer in a sheet-like shape and covering the second main surface of the plurality of solid electrolytic capacitor elements.

A capacitor array that includes a plurality of solid electrolytic capacitor elements each of which has a first main surface and a second main surface facing each other in a thickness direction and includes an anode plate made of a valve action metal, a porous layer on at least one surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer on a surface of the dielectric layer and including a solid electrolyte layer; a first sealing layer in a sheet-like shape and covering the first main surface of the plurality of solid electrolytic capacitor elements; and a second sealing layer in a sheet-like shape and covering the second main surface of the plurality of solid electrolytic capacitor elements.

A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.

A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.

A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.

An electrolytic capacitor includes a capacitor element, a cathode lead terminal, and an exterior body. The cathode lead terminal includes a first cathode lead part facing a first main surface of the capacitor element, a second cathode lead part bent from the first cathode lead part, a third cathode lead part bent from the second cathode lead part, and a fourth cathode lead part bent from the first cathode lead part. The second cathode lead part extends in a direction along a surface intersecting with the first main surface. The third cathode lead part extends to be exposed from the exterior body. The fourth cathode lead part extends along a second main surface of the capacitor element. In the normal direction of the first main surface, a height h of the fourth cathode lead part is less than or equal to a height H from the first cathode lead part to a portion of the third cathode lead part that is not exposed from the exterior body.