An overload protection device for a compressor motor and, more specifically, to an overload protection device for a compressor motor, which has an overload protection means and can thus more effectively prevent overload of the compressor motor.

A molding method includes: setting a bus bar at a first mold main body portion of a fixed mold by supporting a terminal base of a tuning-fork terminal with a terminal base receiving portion of the fixed mold in a state where the tuning-fork terminal is protruded outside a cavity formed by the first mold main body portion of the fixed mold and a second mold main body portion of a movable mold being joined together; joining the movable mold together with the fixed mold by abutting an abut step portion of the movable mold to a receiving abut step portion of the fixed mold and nipping the terminal base of the tuning-fork terminal with the terminal base receiving portion and a terminal base abut portion of the movable mold; and injecting resin into the cavity in the nipped state.

A molding method includes: setting a bus bar at a first mold main body portion of a fixed mold by supporting a terminal base of a tuning-fork terminal with a terminal base receiving portion of the fixed mold in a state where the tuning-fork terminal is protruded outside a cavity formed by the first mold main body portion of the fixed mold and a second mold main body portion of a movable mold being joined together; joining the movable mold together with the fixed mold by abutting an abut step portion of the movable mold to a receiving abut step portion of the fixed mold and nipping the terminal base of the tuning-fork terminal with the terminal base receiving portion and a terminal base abut portion of the movable mold; and injecting resin into the cavity in the nipped state.

A hinge-type actuator device in accordance with the present disclosure may include a first and second paddle, a first and second artificial muscle actuator segment, and a plurality of contacts, where the first and second artificial muscle actuator segments are actuated via the contacts, actuation of the first artificial muscle actuator segment causes the first and second paddle to open the hinge-type actuator, and actuation of the second artificial muscle actuator segment causes the first and second paddle to close the hinge-type actuator.

This power supply device includes: an AC path from an input end to an output end; a current sensor configured to detect a current flowing through the AC path; a conversion unit connected to the AC path and being capable of bidirectional power conversion; a storage battery connected to the AC path via the conversion unit; an AC switch provided between the input end and a point at which the conversion unit is connected to the AC path, the AC switch including parallel body of a relay contact and a semiconductor switch; and a control unit configured to control the conversion unit and the AC switch. When the control unit executes a current conduction mode for the first time, and when the current sensor detects an excessive current during the current conduction mode, the control unit closes only the relay contact while keeping the semiconductor switch opened.

This power supply device includes: an AC path from an input end to an output end; a current sensor configured to detect a current flowing through the AC path; a conversion unit connected to the AC path and being capable of bidirectional power conversion; a storage battery connected to the AC path via the conversion unit; an AC switch provided between the input end and a point at which the conversion unit is connected to the AC path, the AC switch including parallel body of a relay contact and a semiconductor switch; and a control unit configured to control the conversion unit and the AC switch. When the control unit executes a current conduction mode for the first time, and when the current sensor detects an excessive current during the current conduction mode, the control unit closes only the relay contact while keeping the semiconductor switch opened.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.

A protection device comprises a first planar substrate, a second planar substrate, a heater and a fusible element. The first planar substrate comprises a first surface, and the second planar substrate comprises a second surface facing the first surface. The heater comprises a first heating element and a second heating element in parallel connection, and the first heating element is disposed on the first surface. The fusible element is disposed on the first surface and adjacent to the first and second heating elements, thereby the fusible element is melted by absorbing the heat generated by the first heating element and/or second heating element. The second heating element has a resistance at least twice that of the first heating element.

A protection device comprises a first planar substrate, a second planar substrate, a heater and a fusible element. The first planar substrate comprises a first surface, and the second planar substrate comprises a second surface facing the first surface. The heater comprises a first heating element and a second heating element in parallel connection, and the first heating element is disposed on the first surface. The fusible element is disposed on the first surface and adjacent to the first and second heating elements, thereby the fusible element is melted by absorbing the heat generated by the first heating element and/or second heating element. The second heating element has a resistance at least twice that of the first heating element.