The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; and a support unit configured to support and heat a substrate in the treating space, and wherein the support unit includes: at least one heating element for adjusting a temperature of the substrate; a power source for generating a power applied to at least one heating element; a power supply line for transmitting the power generated by the power source to the at least one heating element; a power return line for grounding the at least one heating element; and a current measuring resistor provided on the power supply line or the power return line and used for estimating a temperature of the at least one heating element.

Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

An electrostatic chuck heater includes a ceramic plate, an electrostatic electrode, first and second zone heater electrodes, and first and second zone gas grooves. The ceramic plate includes, on its surface, a wafer placement surface. The electrostatic electrode is embedded in the ceramic plate. The first and second zone heater electrodes are embedded in the ceramic plate, corresponding to respective multiple heater zones into which the wafer placement surface is divided, and allow electric power to be individually supplied to the heater zones. Zone gas grooves are provided corresponding to respective multiple gas supply zones into which the wafer placement surface is divided independently of the heater zones, and allow a gas to be individually supplied to the gas supply zones.

A sample holder for holding a sample carrier carrying a sample includes a sample carrier fixing element. The sample carrier fixing element includes a first section configured, when in a first position, to fix the sample carrier to the sample holder, and, when in a second position, to release the sample carrier or to provide access to an area where the sample carrier is to be located. The sample carrier fixing element also includes a second section different from the first section, the second section being operable such that upon operation of the second section the first section switches from the first position into the second position or from the second position into the first position.

A sample holder transfer device is for use in cryo-microscopy and for transferring a sample holder to an analysing or processing unit. The sample holder is configured for holding a sample carrier carrying a sample. The sample holder transfer device is configured to receive the sample holder, the sample holder including a sample carrier fixing element. At least one section of the sample carrier fixing element is configured, when in a first position, to fix the sample carrier to the sample holder, and, when in a second position, to release the sample carrier or provide access to an area where the sample carrier is to be placed. The sample holder transfer device includes a switching mechanism operable to switch the at least one section of the sample carrier fixing element of the sample holder from the first to the second position or from the second to the first position.

Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.

A wafer placement table includes a ceramic base having a wafer placement surface on its top surface where a wafer is able to be placed and incorporating an electrode, a cooling base bonded to a bottom surface of the ceramic base and having a refrigerant flow channel, a plurality of holes extending through the cooling base in an up and down direction, and a heat exchange promoting portion that is provided in an area around at least one of the plurality of holes and that promotes heat exchange between refrigerant flowing through the refrigerant flow channel and a wafer placed on the wafer placement surface.

A wafer placement table includes a ceramic base including an electrode, a cooling base including a coolant flow path formed therein, a bonding layer bonding the ceramic base and the cooling base, a stepped hole penetrating the bonding layer and the cooling base and including an upper hole portion with a small diameter, a lower hole portion with a large diameter, and a hole stepped portion between the upper hole portion and the lower hole portion, the upper hole portion passing through a region in which the coolant flow path is formed, a stepped insulating pipe inserted through the stepped hole and including an upper pipe portion with a small diameter, a lower pipe portion with a large diameter, and a pipe stepped portion between the upper pipe portion and the lower pipe portion; and a connection terminal bonded to the electrode and inserted through the stepped insulating pipe.

An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

An electrostatic chuck for electrostatically attracting a substrate includes: a chuck body formed of first ceramic particles and having a substrate-facing surface facing the substrate attracted to the electrostatic chuck; and a plurality of convex portions formed on the substrate-facing surface of the chuck body, wherein each of the plurality of convex portions excluding at least a tip-side layer is formed of second ceramic particles having a major axis diameter of 20 μm or more and 2,000 μm or less and has a porosity of 0.1% or more and 1.0% or less.