An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

The present invention relates to a prober device that shapes an input waveform of a dynamic electric signal to be input to one of probes, and observes an output waveform of the dynamic electric signal output through a sample, or preferably shapes the input waveform such that the output waveform of the dynamic electric signal output through the sample becomes approximately a pulse shape, when a response analysis of a dynamic signal is performed with respect to a fine-Structured device. With this, the response analysis of a high-speed dynamic signal equal to or greater than a megahertz level can be performed with respect to the fine-Structured device such as a minute transistor configuring an LSI.

A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.

The present disclosure discloses a sample fixation mechanism for a test with a nano-probe, an apparatus for a test with a nano-probe, and a sample test method. The sample fixation mechanism includes a base having a first assembly surface; a holder having a second assembly surface matched with the first assembly surface, wherein the holder further has a fixation surface opposite to the second assembly surface, and the fixation surface is configured to be adhered and fixed with the sample; a lock structure having a locked state and an unlocked state, wherein in the locked state, the lock structure is capable of fixing the holder relative to the base, and in the unlocked state, the holder may be removed from the base.

A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A pulse current pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the pulse current pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

Electron microscope support structures and methods of making and using same. The support structures are generally constructed using semiconductor materials and semiconductor manufacturing processes. The temperature of the support structure may be controlled and/or gases or liquids may be confined in the observation region for reactions and/or imaging.

A sample holder includes an adapter attached to an adapter attaching part. An analysis target, e.g., analytical cell, has first electrical connection members. The adapter has second electrical connection members. The number of the first electrical connection members and the number of the second electrical connection members are the same. Further, the adapter has third electrical connection members, and the adapter attaching part has fourth electrical connection members. The number of the third electrical connection members and the number of the fourth electrical connection members are the same. For example, the third electrical connection members are six electrically conductive membranes, i.e., a first electrically conductive membrane to a sixth electrically conductive membrane. Among the six electrically conductive membranes, only the third electrically conductive membrane is not electrically connected to any of the second electrical connection members and the first electrical connection members.

Systems and fixtures for mounting, under mechanical constraint, wire-like or fiber-like samples of a high aspect ratio and down to 100 micrometers in diameter are disclosed. A region of interest along the length of the sample resides between and beyond a mechanical constraint on either side, allowing access to the region of interest for a wide number of characterization probes. The fixture may provide electrical isolation between two retaining blocks by means of a dielectric support member. The design may achieve minimal thermal expansion along the length of the sample by the material selection for the dielectric support member. Electrical contact may be introduced to the sample through conductive constraints in the retaining blocks. The fixture may have a minimal size perpendicular to the length axis of the sample to facilitate high probe fluxes when a diverging probe is used. The fixture may provide high x-ray transparency between the retaining blocks. The systems and fixtures as described therefore may provide a means for performing electrical and thermal testing on samples, including but not limited to solder butt-joints, across multimodal in situ characterization and imaging techniques to analyze dynamic electromigration.

An electrical connector for use in electron microscopy sample holders. The electrical connector provides electrical contacts to the sample support devices which are positioned in the sample holders for electrical, temperature and/or electrochemical control.