A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.

An electrical connector for use in electron microscopy sample holders. The electrical connector provides electrical contacts to the sample support devices which are positioned in the sample holders for electrical, temperature and/or electrochemical control.

A probe assembly can be connected and disconnected from its electrical harness within a vacuum chamber so that the probe assembly with the work piece mounted can be rotated and tilted without interference from a cable, and can then be reconnected without opening the vacuum chamber. Also described is a means of grounding a sample and probes when the probe assembly is disconnected from its electrical harness and a means of preventing damage to the probe mechanism and the probe itself by ensuring that the probes are not sticking up too far during operations.

A sample holder includes an adapter attached to an adapter attaching part. An analysis target, e.g., analytical cell, has first electrical connection members. The adapter has second electrical connection members. The number of the first electrical connection members and the number of the second electrical connection members are the same. Further, the adapter has third electrical connection members, and the adapter attaching part has fourth electrical connection members. The number of the third electrical connection members and the number of the fourth electrical connection members are the same. For example, the third electrical connection members are six electrically conductive membranes, i.e., a first electrically conductive membrane to a sixth electrically conductive membrane. Among the six electrically conductive membranes, only the third electrically conductive membrane is not electrically connected to any of the second electrical connection members and the first electrical connection members.

A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.

A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

An electrical connector for use in electron microscopy sample holders. The electrical connector provides electrical contacts to the sample support devices which are positioned in the sample holders for electrical, temperature and/or electrochemical control.

A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

A metal pattern inspection method which applies a pulsed voltage to a metallic pattern, sets a cycle of the pulsed voltage to be shorter than a scanning cycle in which a focused ion beam is swept, indicating only a region of a secondary charged particle image corresponding to a portion of the metallic pattern which is isolated by a wire breakage and to which the pulsed voltage is applied in the form of a first pattern created as a function of surface electrical potentials changing in level with time, detecting, as a disconnection, a boundary between the first pattern and a second pattern created as a function of surface electrical potentials not changing in level with time, and determining whether there is a breaking of or a short circuit in the metallic pattern based on the presence or absence of the disconnection.

A method for testing a packaging substrate with at least one electron beam column is described, wherein the packaging substrate is a panel level packaging substrate or an advanced packaging substrate. The method includes placing the packaging substrate on a stage in a vacuum chamber; directing at least one electron beam of the at least one electron beam column on at least a first portion of the packaging substrate; directing the at least one electron beam of the at least one electron beam column on at least a second portion of the packaging substrate; detecting signal electrons emitted upon impingement of the at least one electron beam for testing a first device-to-device electrical interconnect path of the packaging substrate; and illuminating at least a third portion of the packaging substrate with UV radiation.