A substrate treating apparatus includes a process treating unit providing a treating space for treating a substrate and a plasma generation unit provided above the process treating unit and generating a plasma from a process gas. The plasma generation unit includes a plasma chamber having a discharge space formed therein, an antenna surrounding an outside of the plasma chamber and flowing a high frequency current therethrough, and a cover member surrounding an outside of the antenna, and wherein the cover member is grounded.

To simplify a process of suppressing an increase in a reflected wave power caused by IMD, provided is a high-frequency power supply system for providing a high-frequency power to a load, including: a first power supply for supplying a first high-frequency power to the load; a second power supply for supplying a second high-frequency power to the load; and a matching device. The matching device provides a system clock to each of the first power supply and the second power supply. The second power supply outputs a second high-frequency voltage at a control period determined based on the system clock provided from the matching device. The first power supply outputs a first high-frequency voltage obtained by frequency modulation of a fundamental wave signal having a first fundamental frequency and through amplification, in each control period determined based on the system clock provided from the matching device.

The apparatus includes a process chamber having a treating space therein, a support unit for supporting the substrate in the treating space, a gas supply unit for supplying treating gas to the treating space, and a microwave application unit for applying microwaves to the treating gas to generate plasma. The microwave application unit may include first power supply for applying a first microwave, a support plate having a groove formed on an upper surface thereof and combined with the process chamber above the support unit to define the treating space, a first transmission plate inserted into the groove to radiate the first microwave to the treating space, and a first waveguide disposed to overlap with an upper portion of the first transmission plate and coupled to the first power supply, wherein a plurality of grooves may be formed along a circumferential direction in an edge region of the support plate.

A plasma processing apparatus includes an electrode to which a high frequency for plasma generation is applied and which serves as a mounting table for a target object. The plasma processing apparatus further includes a high frequency generation unit, a distortion component extraction unit and a waveform correction unit. The high frequency generation unit generates the high frequency by using waveform data including a set frequency component having a predetermined frequency. The distortion component extraction unit extracts a distortion component given to the high frequency in a path for transmitting the high frequency generated by the high frequency generation unit to the electrode. The waveform correction unit corrects the waveform data by combining an antiphase component obtained by inverting a phase of the distortion component and the set frequency component of the waveform data used for generation of the high frequency.

A transfer chamber for a processing system suitable for processing a plurality of substrates and a method of using the same is provided. The transfer chamber includes a lid, a bottom disposed opposite the lid, a plurality of sidewalls sealingly coupling the lid to the bottom and defining an internal volume, wherein the plurality of sidewalls form the faces of a dodecagon. An opening is formed in each of the faces, wherein the opening is configured for a substrate to pass therethrough. A transfer robot is disposed in the internal volume, wherein the transfer robot has effectors configured to support the substrate through one opening to another opening.

Embodiments described herein relate to apparatus and methods for processing a substrate. In one embodiment, a cluster tool apparatus is provided having a transfer chamber and a pre-clean chamber, a self-assembled monolayer (SAM) deposition chamber, an atomic layer deposition (ALD) chamber, and a post-processing chamber disposed about the transfer chamber. A substrate may be processed by the cluster tool and transferred between the pre-clean chamber, the SAM deposition chamber, the ALD chamber, and the post-processing chamber. Transfer of the substrate between each of the chambers may be facilitated by the transfer chamber which houses a transfer robot.

A plasma battle includes a lower ring and an upper ring that extends upwardly from an edge of the lower ring. The lower ring includes a lower central hole on a center of the lower ring and vertically penetrating the lower ring and a lower slit outside the lower central hole and vertically penetrating the lower ring. The upper ring includes an upper central hole on a center of the upper ring and vertically penetrating the upper ring and an upper slit that penetrates the upper ring so as to connect an inner lateral surface of the upper ring to an outer lateral surface of the upper ring.

The invention describes a method of frequency tuning an electrical generator (100) for supplying electrical power to a plasma, wherein the method comprises a pulsed mode, the pulse mode comprising at least a high power pulse (314) comprising a high power level (304) and a low power pulse (312) comprising a low power level (302) different to zero power, the method comprising the steps of: —providing RF-power with a high power starting frequency set comprising at least one high power starting frequency (502, 504, 506) at the high power pulse (314) with a predefmed high power pulse shape; —providing RF-power with a low power starting frequency set comprising at least one low power starting frequency (512, 514) at the low power pulse (312) with a predefmed low power pulse shape; —determining a reflected high power at the high power starting frequency (502, 504, 506); —tuning the high power starting frequency (502, 504, 506) to a different first high power frequency if the reflected high power exceeds a high power threshold value such that the reflected high power decreases below the high power threshold value; —determining a reflected low power at the low power starting frequency (512, 514); —tuning the low power starting frequency (512, 514) to a different first low power frequency if the reflected low power exceeds a low power threshold value such that the reflected low power decreases below the low power threshold value. The invention further describes a corresponding electrical generator (100), plasma processing system and computer program product. The method, the electrical generator, the plasma processing system and the computer program product may have the advantage that the stability of the plasma with respect to repeated and essentially identical high and low power pulses is used to reduce the controlling effort and to check the stability of the plasma process.

Some embodiments provide a magnetron sputtering apparatus including a vacuum chamber within which a controlled environment may be established, a target comprising one or more sputterable materials, wherein the target includes a racetrack-shaped sputtering zone that extends longitudinally along a longitudinal axis and comprises a straightaway area sandwiched between a first turnaround area and a second turnaround area, a gas distribution system that supplies a first gas mixture to the first turnaround area and/or the second turnaround area and supplies a second gas mixture to the straightaway area, wherein the first gas mixture reduces a sputtering rate relative to the second gas mixture. In some cases, the first gas mixture includes inert gas having a first atomic weight and the second gas mixture includes inert gas having a second atomic weight, wherein the second atomic weight is heavier than the first atomic weight.

A plasma processing apparatus can control a ratio between an input power during a pulse-on period and an input power during a pulse-off period by a matching operation of a matching device provided on a high frequency transmission line for supplying the high frequency power as a continuous wave without a power modulation. An impedance sensor 96A provided in a matching device of a plasma generation system includes a RF voltage detector 100; a voltage-detection-signal generating circuit 102; an arithmetic-average-value calculating circuit 104; a weighted-average-value calculating circuit 106; and a moving-average-value calculating unit 108 of a voltage sensor system, and also includes a RF electric current detector 110; an electric current-detection-signal generating circuit 112; an arithmetic-average-value calculating circuit 114; a weighted-average-value calculating circuit 116; a moving-average-value calculating unit 118; and an impedance calculating circuit 120 of an electric current sensor system.