A device and a method of heating nano- to micro-scale light absorbent particles within a flashtube designed to sequentially emit intense light, followed by an intense pressure wave. The flashtube device includes a housing and a central filament surrounded by the housing. An inner surface of the housing can be coated with light-scattering particles and/or light-absorbing particles. The filament is generally held in a superconducting state.

A thermal emission source is provided that has a structure capable of suppressing deterioration of an optical assembly over time. The thermal emission source includes an optical assembly (1) having an optical structure in which a member made of a semiconductor has a refractive index distribution so as to resonate with light of a wavelength shorter than a wavelength that corresponds to an absorption edge corresponding to a band gap of the semiconductor. The optical assembly (1) includes a coating structure (30) with a coating material that differs from the semiconductor of refractive portions (10) and through which light of a wavelength included in a wavelength range from visible light to far infrared rays can be transmitted.

Provided is a radiation light source that enables adjustment of infrared radiation to a significantly narrow band. A plasmonic reflector layer consisting of a plasmonic material, a resonator layer consisting of an insulator, and a partially reflecting layer are alternately laminated in this order to form a multi-layered radiation light source, wherein the partially reflecting layer are selected from any one of a free interface, an ultrathin-film metallic layer, and a distributed reflector layer having a structure in which layers having different refractive indexes are alternately laminated. When a material with high-temperature resistance such as SiC is used in the outermost layer of the distributed reflector layer, the multi-layered radiation light source can operate at high temperatures of 550° C. and higher.

An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.

An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.

The present invention provides a thermal radiation light source that allows a wider range of material choices than those of conventional techniques, so that light having a desired peak wavelength can easily be obtained. A thermal radiation light source 10 includes a thermo-optical converter made of an optical structure in which a refractive index distribution is formed in a member 11 made of an intrinsic semiconductor so as to resonate with light of a shorter wavelength than a wavelength corresponding to a bandgap of the intrinsic semiconductor. When heat is externally supplied to the thermo-optical converter, light having a spectrum in a band of shorter wavelengths than a cutoff wavelength is produced by interband absorption in the intrinsic semiconductor, and light of a resonant wavelength .sub.r in the wavelength band, the light causing resonance in the optical structure, is selectively intensified and emitted as thermal radiation light. In the present invention, an intrinsic semiconductor that provides a wide range of material choices is used, so that a thermal radiation light source that produces narrow-band light having a desired peak wavelength can easily be obtained.

An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.

A microelectromechanical light emitter component comprises an emitter layer structure of the microelectromechanical light emitter component and an inductive structure of the microelectromechanical light emitter component. The inductive structure of the microelectromechanical light emitter component is configured to generate current in the emitter layer structure by electromagnetic induction, such that the emitter layer structure emits light. The emitter layer structure is electrically insulated from the inductive structure.

A workpiece support, such as an end effector, is coated on at least one of its surfaces with an anti-reflective material. The anti-reflective material improves the transmission of light through the workpiece support. The workpiece support may be disposed in a chamber, with heating elements disposed beneath the workpiece support, such that the workpiece support is disposed between the heating elements and the workpiece. In certain embodiments, the heating elements may be LEDs or tungsten halogen lamps. The anti-reflective material allows more efficient energy transfer from the heating elements to the workpiece. This may result in improved temperature uniformity across the workpiece. The anti-reflective material may be magnesium fluoride or a multi-layer optical coating. Alternatively, the heating elements may be disposed above the workpiece. In this case, the reduced reflection from the workpiece support may minimize the temperature increase on the portion of the workpiece disposed above the workpiece support.

A workpiece support, such as an end effector, is coated on at least one of its surfaces with an anti-reflective material. The anti-reflective material improves the transmission of light through the workpiece support. The workpiece support may be disposed in a chamber, with heating elements disposed beneath the workpiece support, such that the workpiece support is disposed between the heating elements and the workpiece. In certain embodiments, the heating elements may be LEDs or tungsten halogen lamps. The anti-reflective material allows more efficient energy transfer from the heating elements to the workpiece. This may result in improved temperature uniformity across the workpiece. The anti-reflective material may be magnesium fluoride or a multi-layer optical coating. Alternatively, the heating elements may be disposed above the workpiece. In this case, the reduced reflection from the workpiece support may minimize the temperature increase on the portion of the workpiece disposed above the workpiece support.