A method of controlling plasma includes providing a plasma processing apparatus that includes N microwave introducing radiators disposed in a circumferential direction of a ceiling plate of a processing container so as to introduce microwaves for generating plasma into the processing container, wherein N≥2; and M sensors and configured to monitor at least one of electron density Ne and electron temperature Te of the plasma generated in the processing container, wherein M equals to N or a multiple of N. The method further includes controlling at least one of a power and a phase of the microwaves introduced from the microwave introducing radiators based on at least one of electron density Ne and electron temperature Te of the plasma monitored by the M sensors.

Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

A method for semiconductor fabrication includes mounting a wafer onto a first wafer table. The first wafer table includes a first set of pins that support the wafer, the first set of pins having a first pitch between adjacent pins. The method further includes forming a first set of overlay marks on the wafer; and transferring the wafer onto a second wafer table. The second wafer table includes a second set of pins having a second pitch between adjacent pins. The second set of pins are individually and vertically movable, and the second pitch is smaller than the first pitch. The method further includes moving a portion of the second set of pins such that a remaining portion of the second set of pins supports the wafer and the remaining portion has the first pitch between adjacent pins.

The disclosure provides a silicon photovoltaic cell scanning eddy current thermography detection platform and a defect classification method. The technical solution adopted by the disclosure is: firstly, fixing the position of the electromagnetic inductive coil and the thermal imager, and using the main conveyor belt to carry the silicon photovoltaic cell to move forward on the production line to form a scanning eddy current heating of the silicon photovoltaic cell. Secondly, the defect temperature information is obtained through the thermal imager in terms of thermal image sequences. Thirdly, the feature extraction algorithms are used to extract the silicon photovoltaic cell defect features. Finally, the image classification algorithms are used to classify the silicon photovoltaic cell defects, and the sorting conveyor belts are used to realize the automatic sorting of silicon photovoltaic cells with different types of defects on the production line.

A method of detecting defects in a structure sample comprising a thin film layer and a sacrificial later is disclosed. The method comprises exposing the thin film layer to a vapour phase etchant, obtaining an image of the thin film layer and analysing the image. The vapour phase etchant enhances any defects present in the thin film layer by passing through the defect and etching a cavity within the sacrificial layer. The cavity undercuts the thin film layer resulting in a stress region surrounding the defect. Defects which were not originally detectable may be made detectable after exposure to the vapour phase etchant. A vapour phase etchant has the advantage of being highly mobile such that it can access defects that a liquid phase etchant might not. Furthermore, unlike a liquid phase etchant, a vapour phase etchant can be used to test a sample non-destructively.

Systems and methods to achieve desired color accuracy, power consumption, and gamma correction in an array of pixels of a micro-LED display. The method and system provides an array of pixels, wherein each pixel comprising a plurality of sub-pixels arranged in a matrix and a driving circuitry configured to provide an individual emission control signal to each sub-pixel of each pixel in the array of pixels to independently control a emission time and a duty cycle of each sub-pixel.

A method for manufacturing an electronic device includes: providing a substrate; forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate; forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, and an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and bonding a plurality of light emitting units to the plurality of connecting pads.

An apparatus for inspecting light emitting elements, a method of inspecting light emitting elements using the apparatus, and a method of manufacturing display device using the apparatus are provided. The apparatus includes a flow path unit extending in one direction and including a flow path along which a solution in which light emitting elements are mixed moves, at least one alignment unit to which the flow path extends from at least a portion of the flow path unit, a packaging unit at an end of the flow path unit and in which the light emitting elements are stacked, and a plurality of alignment electrodes on an outer surface of the alignment unit.

Embodiments relate to one or more techniques that may be employed alone or in combination, in the refurbishment or recycling of used solar modules. In certain approaches, a (heated) wire may be used to cut through one or more layers (e.g., front encapsulant, back encapsulant, both front and back encapsulant, backsheet) of a solar module that is being recycled or refurbished. Some approaches may employ testing of a used solar module, alone or in combination with information (e.g., as part of a received package) regarding parameters of a used solar module such as panel size, width, length, height, thickness of glass, or others. According to specific embodiments, used solar modules may be subjected to various cleaning processes at one or more points during refurbishment/recycling.

A piezoelectric substrate manufacturing device that includes first and electrodes that face each other with a piezoelectric substrate interposed therebetween; a cover that surrounds the second electrode such that the leading end of the second electrode is exposed; a supply unit that supplies a processing gas to an internal space of the cover; a processing unit that performs surface processing on the piezoelectric substrate by applying a voltage between the first and second electrodes causing the processing gas to change into plasma; a detector that is provided outside the cover with its relative position fixed with respect to the second electrode; a measurement unit that measures the thickness of the piezoelectric substrate using the detector; a driving unit that changes the relative positions of the first and second electrodes; and a control unit that controls the supply unit, the processing unit, the measurement unit, and the driving unit.