A cooling and heating system for an electronic component comprises a thermoelectric element disposed near the electronic component and an electrical circuit for a bidirectional current, where the thermoelectric element is connected to the electrical circuit for the bidirectional current. The cooling and heating system further comprises a controller configured to control a current flow direction of the bidirectional current in the thermoelectric element to cool or heat the electronic component, where whether the electronic component is to be cooled or heated is based on the current flow direction of the bidirectional current in the thermoelectric element.

A chip-carrying structure and a chip-bonding method are provided. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters. Therefore, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.

Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.

Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.

Systems and methods for manipulating the temperature of a surface are described. Described embodiments include thermal adjustment devices that may include a heatsink and that are operated in two or more modes of operation to apply a desired temperature to a user. In one operating mode the thermal adjustment device may apply a first temperature to an underlying surface while generating heat at a rate faster than the heatsink's heat dissipation rate. The thermal adjustment device may then apply a second temperature to reduce the rate of heat generation to be less than the heatsink's heat dissipation rate. These modes of operation may be applied cyclically to permit continuous operation of the thermal adjustment device. In some embodiments, the temperature profile applied when changing between the modes of operation may be selected such that the user experiences either a reduced, or substantially, neutral thermal sensation.

A semiconductor structure having: a crystalline substrate; a single crystalline semiconductor layer grown on the substrate; and a heat generating semiconductor device formed on a portion of the single crystalline layer. The substrate has an aperture in a selected portion thereof disposed in regions in the semiconductor layer under the heat generating device the aperture extending from a bottom portion of the substrate to the single crystalline semiconductor layer. Single crystalline or polycrystalline, thermal conductive material is disposed in the aperture, such material filling the aperture and extending from the bottom of the substrate, to and in direct contact with, the semiconductor layer.

An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

A method may include thinning a silicon wafer to a particular thickness. The particular thickness may be based on a passband frequency spectrum of an adjustable optical filter. The method may also include covering a surface of the silicon wafer with an optical coating. The optical coating may filter an optical signal and may be based on the passband frequency spectrum. The method may additionally include depositing a plurality of thermal tuning components on the coated silicon wafer. The plurality of thermal tuning components may adjust a passband frequency range of the adjustable optical filter by adjusting a temperature of the coated silicon wafer. The passband frequency range may be within the passband frequency spectrum. The method may include dividing the coated silicon wafer into a plurality of silicon wafer dies. Each silicon wafer die may include multiple thermal tuning components and may be the adjustable optical filter.

An inertia measure unit (IMU) includes a main circuit board, and first and second weight blocks. A first surface of the first weight block contacts the main circuit board. The first weight block includes a recess formed on a second surface thereof opposite to the first surface, and an opening formed on a side surface thereof. The second weight block is coupled to the first weight block on the second surface to cover the recess. The first and second weight blocks jointly form an inner chamber in communication with the opening. The IMU further includes a circuit board disposed in the inner chamber, and a signal line coupled to an edge of the circuit board and extending out of the opening. The signal line bends over an outer surface of the first weight block or the second weight block to connect to the main circuit board.

The present disclosure presents a heat exchange plate with slotted airfoil fins for a printed circuit heat exchanger. In the present disclosure, a herringbone streamlined slot is arranged on a fin so that a part of the heat exchange fluid can flow through a channel of the slot and flow out from the tail of the fin. In such a way, the perpendicular hitting on the fin can be prevented, thereby prevent forming of the stagnation area, mitigating phenomenon of substantial flow resistance in this area and, in turn, reducing the pressure drop of channel. Meanwhile, the slotted area could substantially increase the heat exchanging area and thus improve the heat exchanging performance.