Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

A semiconductor structure includes a semiconductor substrate, a semiconductor device and a heating structure. The semiconductor substrate includes a device region and a heating region surrounding the device region. The semiconductor device is located on the device region. The heating structure is located on the heating region and includes an intrinsic semiconductor area, at least one heating element and at least one heating pad. The intrinsic semiconductor area is surrounding the semiconductor device. The at least one heating element is located at a periphery of the intrinsic semiconductor area. The at least one heating pad is joined with the at least one heating element, wherein the at least one heating pad includes a plurality of contact structures, and a voltage is supplied from the plurality of contact structures to control a temperature of the at least one heating element.

A system includes a platform and a contactor. The platform has a side configured to support a frame with a carrier structure and electronic devices each having first and second sides and a terminal, the first side positioned on the carrier structure, and the terminal exposed in a first portion of the second side. The contactor has first and second sides, a contact and a heater. The contact is exposed on the first side of the contactor to contact the terminal in a first portion of the second side of a selected one of the electronic devices, and the heater is exposed on the first side of the contactor to apply heat to a second portion of the second side of the selected one of the electronic devices.

A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.

A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may determine whether the IC temperature is less than a threshold value. The apparatus may initiate a joule heating procedure using a joule heating element of the IC upon determining that the temperature is less than the threshold value. The apparatus may delay an initiation of the one or more processors of the IC until the IC temperature meets the threshold value.

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

The present invention concerns a heating assembly (10, 15) for generating heat in order to carry out temperature-dependent tests on an electronic component (3, 200) arranged inside a socket (2), the heating assembly (10, 15) comprising: A heating device (10) comprising electrically conductive material in such a manner as to allow the passage of an electrical current to produce heat; According to the invention, the assembly further comprises: A covering (15) of thermally insulating material suitable for containing said heating device (10) inside, the covering having at least an opening on one side for allowing the hear diffusion through said opening; Fastening means for fastening said covering (15) to a support surface (5B), in such a manner that, while used, the heading device (10), arranged inside said covering (15) faces said support surface (5B) through said opening.

A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.

Embodiments of the disclosure relate to a method for creating a strip of electronic components. In the method, a ribbon of ceramic substrate is provided. The ceramic substrate defines a thickness of no more than 200 μm between a first outer surface and a second outer surface opposite of the first outer surface. A conductive layer is applied to at least one of the first outer surface or the second outer surface of the ceramic substrate. The ceramic substrate is then singulated into individual slabs, and the individual slabs are laminated to a strip of polymeric carrier. The polymeric carrier has a flexural rigidity less than the flexural rigidity of the ceramic substrate. Additionally, embodiments of a roll of electronic components are provided.