The invention is notably directed to a transflective display device. The device comprises a set of pixels, wherein each of the pixels comprises a portion of bi-stable, phase change material, hereafter a PCM portion, having at least two reversibly switchable states, in which it has two different values of refractive index and/or optical absorption. The device further comprises one or more spacers, optically transmissive, and extending under PCM portions of the set of pixels. One or more reflectors extend under the one or more spacers. An energization structure is in thermal or electrical communication with the PCM portions, via the one or more spacers. Moreover, a display controller is configured to selectively energize, via the energization structure, PCM portions of the pixels, so as to reversibly switch a state of a PCM portion of any of the pixels from one of its reversibly switchable states to the other. A backlight unit is furthermore configured, in the device, to allow illumination of the PCM portions through the one or more spacers. The backlight unit is controlled by a backlight unit controller, which is configured for modulating one or more physical properties of light emitted from the backlight unit. The invention is further directed to related devices and methods of operation.

A semiconductor device structure and method for manufacturing the same are provided. The method includes forming a first resistive element over a substrate, and the first resistive element has a first sidewall extending in a first direction and a second sidewall opposite to the first sidewall and extending in the first direction. The method further includes forming a first conductive feature and a second conductive feature over and electrically connected to the first resistive element and forming a second resistive element over the first resistive element and spaced apart from the first resistive element in a second direction. In addition, the second resistive element is located between the first sidewall and the second sidewall of the first resistive element in a top view, and the first resistive element and the second resistive element are made of different nitrogen-containing materials.

A chip package comprises a chip having a first temperature sensor. The first temperature sensor is configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier coupled to the chip via a plurality of solder connections. The chip carrier includes a second temperature sensor vertically aligned with the first temperature sensor. The second temperature sensor is configured to measure a second temperature of the chip carrier in a localized area around the second temperature sensor. The chip carrier further includes a localized heater element located near the second temperature sensor and configured to generate heat in response to a detected difference based on comparison of the first temperature and the second temperature such that the detected difference is adjusted in the localized area around the first temperature sensor.

Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.

Apparatus and methods are provided for managing operations of a semiconductor chip. In an exemplary embodiment, there is provided a semiconductor chip that may comprise a temperature sensor, a thermal heater, a processor and thermal control logic. The thermal control logic may be configured to: determine that a first temperature read-out from the temperature sensor reaches a first temperature threshold value, turn on the thermal heater, determine that a second temperature read-out from the temperature sensor reaches a second temperature threshold value that is lower than the first temperature threshold value, suspend functions of the processor, determine that a third temperature read-out from the temperature sensor reaches the first temperature threshold value, resume the functions of the processor, determine that a fourth temperature read-out from the temperature sensor reaches a third temperature threshold value that is higher than the first temperature threshold value and turn off the thermal heater.

An electronic-component-mounted module has an electronic component, a first silver-sintered bonding layer bonded on one surface of the electronic component, a circuit layer made of copper or copper alloy and bonded on the first silver-sintered bonding layer, and a ceramic substrate board bonded on the circuit layer, and further has an insulation circuit substrate board with smaller linear expansion coefficient than the electronic component, a second silver-sintered bonding layer bonded on the other surface of the electronic component, and a lead frame with smaller linear expansion coefficient than the electronic component bonded on the second silver-sintered bonding layer; and a difference in the linear expansion coefficient between the insulation circuit substrate board and the lead frame is not more than 5 ppm/° C.

A semiconductor apparatus includes a substrate, a plurality of heat generating elements mounted on the substrate, a heat dissipation member fixed to the substrate and disposed such that the heat generating elements are interposed between the heat dissipation member and the substrate, at least one first heat conduction member provided on a first surface of the heat dissipation member, the first surface facing the heat generating elements, and a plurality of second heat conduction members each provided on a second surface of a corresponding one of the heat generating elements, the second surface facing the heat dissipation member, wherein the at least one first heat conduction member and the second heat conduction members are in contact with each other at an interface between opposing surfaces thereof.

Novel integrated circuit environmental and temperature sensors in combination with measurement circuitry fully integrated as part of an ASIC die, which may be co-packaged with a pressure sensor integrated circuit to create a compact yet sensitive environment monitoring product. Embodiments may include one or more integrated local heating elements and control circuitry that are power supply independent, make efficient use of battery power, include an accurate in-built temperature detection capability, and provide digital close-loop control of the heating elements.

A cooling and heating system for an electronic component comprises a thermoelectric element disposed near the electronic component and an electrical circuit for a bidirectional current, where the thermoelectric element is connected to the electrical circuit for the bidirectional current. The cooling and heating system further comprises a controller configured to control a current flow direction of the bidirectional current in the thermoelectric element to cool or heat the electronic component, where whether the electronic component is to be cooled or heated is based on the current flow direction of the bidirectional current in the thermoelectric element.

Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.