A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.

A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.

In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.

A flatpack air chiller device is disclosed. In embodiments, the air chiller device includes a primary chiller or pre-chiller subsystem and a secondary or main chiller subsystem within a housing. The pre-chiller subsystem receives and chills ambient air via cold-side contact with a primary thermoelectric device and directs the pre-chilled ambient airstream to the hot side of a secondary thermoelectric device. The secondary or main chiller subsystem is connected to a recirculating air stream, e.g., circulating through the interior airspaces, compartments, or bays of a galley structure. The pre-chilled ambient airstream absorbs heat from the secondary hot side to progressively chill the recirculating air stream, which is in contact with the cold side of the secondary thermoelectric device before recirculation back into the galley structure interior.

A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip bumps between the first package substrate and the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a molding member which covers the plurality of second semiconductor chips, on the first semiconductor chip, and a thermoelectric cooling layer attached onto a surface of the first semiconductor chip. The thermoelectric cooling layer includes a cooling material layer extending along the surface of the first semiconductor chip, a first electrode pattern which surrounds the plurality of first chip bumps from a planar viewpoint, in the cooling material layer, and a second electrode pattern which surrounds the first electrode pattern from the planar viewpoint, in the cooling material layer.

A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip bumps between the first package substrate and the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a molding member which covers the plurality of second semiconductor chips, on the first semiconductor chip, and a thermoelectric cooling layer attached onto a surface of the first semiconductor chip. The thermoelectric cooling layer includes a cooling material layer extending along the surface of the first semiconductor chip, a first electrode pattern which surrounds the plurality of first chip bumps from a planar viewpoint, in the cooling material layer, and a second electrode pattern which surrounds the first electrode pattern from the planar viewpoint, in the cooling material layer.

A multilayer thermoelectric sensor for generating an electric current under the effect of heating includes a support and a thermocouple borne by the support. The thermocouple includes a first thermoelectric member having at least a portion of a bilayer, the layers of which are made of different materials, and a second thermoelectric member having a p-doped semiconductor material and/or a thermoelectric metal. The thermocouple is configured to generate an electron gas at the interface between the layers of the bilayer when the thermoelectric sensor is heated.

A cooling sub-assembly for cooling a heat dissipating electronic device. The sub-assembly may include a vapor chamber, a peltier element and a coldplate placed on top of each other forming a stack such that the peltier element is sandwiched between the vapor chamber and the coldplate. The vapor chamber has a head facing the peltier element, a foot for facing the heat dissipating electronic device, and a wall extending between the foot and the head. The area of the head is larger than the area of the foot.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.