Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.

An object is to provide a technique capable of suppressing reduction in sticking force of a semiconductor package and a radiation fin in a semiconductor device including the semiconductor package and the radiation fin when the semiconductor package and the radiation fin stick and are fixed to each other by magnetic force. A semiconductor device includes: a semiconductor package; an insulating substrate; a radiation fin; a first fixed part made up of one of a magnetic body and a bond magnet integrally formed with the semiconductor package; and a second fixed part made up of another one of the magnetic body and the bond magnet integrally formed with the radiation fin, wherein the semiconductor package and the radiation fin stick to each other by magnetic force occurring between the first fixed part and the second fixed part.

An object is to provide a technique capable of suppressing reduction in sticking force of a semiconductor package and a radiation fin in a semiconductor device including the semiconductor package and the radiation fin when the semiconductor package and the radiation fin stick and are fixed to each other by magnetic force. A semiconductor device includes: a semiconductor package; an insulating substrate; a radiation fin; a first fixed part made up of one of a magnetic body and a bond magnet integrally formed with the semiconductor package; and a second fixed part made up of another one of the magnetic body and the bond magnet integrally formed with the radiation fin, wherein the semiconductor package and the radiation fin stick to each other by magnetic force occurring between the first fixed part and the second fixed part.

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Provided are an electronic drive device and an electronic steering device, in each of which: a mounting substrate has one surface as a first surface on which a first heat generating component is mounted and the other surface as a second surface on which a second heat generating component is mounted; a first heat dissipation member is arranged in contact with the second surface at a position corresponding to a mounted position of the first heat generating component such that heat generated by the first heat generating component is dissipated to a motor housing; and a second heat dissipation member is arranged in contact with the first surface at a position corresponding to a mounted position of the second heat generating component such that heat generated by the second heat generating component is dissipated to a cover.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.