A problem is that close contact with a heat dissipation surface of a power semiconductor device is not sufficient, and thus heat dissipation performance is low. A thermally conductive layer 5 abuts on a heat dissipation surface 4a of a circuit body 100, and a heat dissipation member 7 abuts on the outside of the thermally conductive layer 5, which is a side of the heat dissipation surface 4a of the circuit body 100. A fixing member 8 abuts on a side of the circuit body 100 opposite to the heat dissipation surface 4a. A connection member 9 is penetrated at the respective end portions of the heat dissipation member 7 and the fixing member 8. FIG. 3 illustrates a state before a bolt and a nut of the connection member 9 are tightened. The heat dissipation member 7 holds a curved shape such that the central portion of the heat dissipation member 7 protrudes toward the circuit body 100. The bolt and the nut of the connection member 9 are fastened and fixed at both ends of the heat dissipation member 7 and the fixing member 8 so as to sandwich the circuit body 100. The heat dissipation member 7 is elastically deformed to bring the heat dissipation member 7 into close contact with the heat dissipation surface 4a of the circuit body 100 via the thermally conductive layer 5, and surface pressure is applied from the heat dissipation member 7 to the heat dissipation surface 4a.

A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

This application discloses a board, an electronic device, and a manufacturing method, and pertains to the field of bare die package technologies. The board includes a PCB assembly, a bare die, a reinforcing frame, a heat sink, and fasteners. Both the bare die and the reinforcing frame are located on a surface of the PCB assembly, the bare die is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly by using the fastener. The heat sink is located on a surface of the bare die that is away from the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame by using the fastener.

This application discloses a board, an electronic device, and a manufacturing method, and pertains to the field of bare die package technologies. The board includes a PCB assembly, a bare die, a reinforcing frame, a heat sink, and fasteners. Both the bare die and the reinforcing frame are located on a surface of the PCB assembly, the bare die is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly by using the fastener. The heat sink is located on a surface of the bare die that is away from the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame by using the fastener.

An integrated circuit assembly including a first die including a device side and a backside opposite the device side; and a second die including a plurality of fluidly accessible channels therein, wherein the second die is coupled to a backside of the first die. A method of fabricating an integrated circuit assembly including coupling a first die to a second die, wherein the first die includes a device side and an opposite backside, wherein the device side includes a plurality of integrated circuits and wherein the second die includes a plurality of fluidly accessible channels therein.

An integrated circuit assembly including a first die including a device side and a backside opposite the device side; and a second die including a plurality of fluidly accessible channels therein, wherein the second die is coupled to a backside of the first die. A method of fabricating an integrated circuit assembly including coupling a first die to a second die, wherein the first die includes a device side and an opposite backside, wherein the device side includes a plurality of integrated circuits and wherein the second die includes a plurality of fluidly accessible channels therein.

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

An arrangement having a cooling device for dissipating heat from articles to be cooled which has at least one heat sink that has a heat absorption surface composed of metal and that is intended to absorb heat from one or more articles to be cooled, and also a cooling fluid chamber for accommodating cooling fluid to which the heat absorbed by the heat sink can be transferred, and having at least one article to be cooled which has a preferably planar heat emission surface composed of metal. To optimize the heat conduction between the heat sink and the article to be cooled, the heat absorption surface of the heat sink bears directly against the heat emission surface of the article to be cooled without an intermediate layer composed of air-displacing material, or, if necessary, with the use of an intermediate layer composed of air-displacing material that is thin.

A package system and a manufacturing method thereof are provided. The package system includes a semiconductor package and a thermal-dissipating structure. The semiconductor package includes a first surface and a second surface opposing to each other, and a planarity of the second surface is greater than that of the first surface. The thermal-dissipating structure includes a first plate secured to the semiconductor package, a gasket interposed between the first plate and the semiconductor package, a second plate secured to the semiconductor package opposite to the first plate, and a first thermal interface material layer interposed between the second plate and the second surface of the semiconductor package. The gasket includes a plurality of hollow regions corresponding to portions of the first surface of the semiconductor package.