The inventive device efficiently cools, with a simple construction, heat generated from an ultraviolet light-emitting diode (UV-LED). The UV-LED is accommodated in a housing that has an open end and an ultraviolet-transparent closing end. A portion of the housing adjacent to the closing end contacts to-be-treated liquid, ultraviolet rays generated from the UV-LED are irradiated to the to-be-treated liquid, and the housing is cooled by the to-be-treated liquid. In this way, the heat generated from the UV-LED can be cooled with a simple construction without use of arrangements for introducing dedicated cooling fluid for cooling the UV-LED. A heat discharge block for discharging to the outside the heat generated from the UV-LED may be provided at or adjacent to the open end of the housing. Further, the present invention may be constructed in such a manner that a portion of the discharge section directly contacts the to-be-treated liquid.

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

A semiconductor device including a substrate, a semiconductor package, a plurality of pillars and a lid is provided. The semiconductor package is disposed on the substrate and includes at least one semiconductor die. The plurality of pillars are disposed on the semiconductor package. The lid is disposed on the substrate and covers the semiconductor package and the plurality of pillars. The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid. An inner surface of the lid, which faces and overlaps the plurality of pillars along a stacking direction of the semiconductor package and the lid, is a flat surface.

An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

An electronic device system that includes electronic devices and a cooling device to cool an object of the electronic devices. The cooling device includes coolers; a water-supply pipe that has branch pipes and supplies a coolant to the coolers, each of the branch pipes being coupled with each of the coolers; a waste pipe that has branch pipes, each of which is coupled with each of the coolers; a circulation pipe that couples an inlet of the water-supply pipe with an outlet of the waste pipe and has a pump to discharge the coolant and a coolant cooler to cool the coolant; and a bypass flow path that is coupled with at least a top edge portion of the water-supply pipe, bypasses the plurality of coolers, and is coupled with the waste pipe. The coolant having passed through the coolers is exhausted to the waste pipe.

An electronic device system that includes electronic devices and a cooling device to cool an object of the electronic devices. The cooling device includes coolers; a water-supply pipe that has branch pipes and supplies a coolant to the coolers, each of the branch pipes being coupled with each of the coolers; a waste pipe that has branch pipes, each of which is coupled with each of the coolers; a circulation pipe that couples an inlet of the water-supply pipe with an outlet of the waste pipe and has a pump to discharge the coolant and a coolant cooler to cool the coolant; and a bypass flow path that is coupled with at least a top edge portion of the water-supply pipe, bypasses the plurality of coolers, and is coupled with the waste pipe. The coolant having passed through the coolers is exhausted to the waste pipe.

The present application discloses a rotary liquid distributor for a liquid-cooled tank, and a liquid-cooled tank. The rotary liquid distributor includes a liquid distribution cavity and a liquid distribution arm provided in the liquid distribution cavity. The liquid distribution cavity rotates around a central shaft thereof. A plurality of the liquid distribution arms are uniformly distributed in a circumferential direction of the liquid distribution cavity. That is, the liquid distribution arm rotates with the liquid distribution cavity. Then, a liquid distribution outlet is provided between a first end and a second end of the liquid distribution arm. The liquid distribution outlet is located on a side of the liquid distribution arm facing away from a rotating direction.

An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.