A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.

A back-contacting solar cell includes: a silicon substrate (1), wherein a shadow face of the silicon substrate (1) is delimited into a first region and a second region (2), and the second region (2) is doped to form a second-charge-carrier collecting end; a metal-chalcogen-compound layer (4), wherein the metal-chalcogen-compound layer (4) is deposited within at least the first region of the silicon substrate (1), and a region of the metal-chalcogen-compound layer (4) that corresponds to the first region forms a first-charge-carrier collecting end; a first electrode (5), wherein the first electrode (5) is correspondingly provided on the first-charge-carrier collecting end; and a second electrode (6), wherein the second electrode (6) is correspondingly provided within a region that corresponds to the second region (2). The collection and transferring of the first charge carrier are realized by using the first-charge-carrier collecting end.

The present invention provides a normal-incident photodiode structure with a dark current self-compensation function, including a photosensitive photodiode and a compensating photodiode, where a photosensitive surface of the compensating photodiode is provided with a light-blocking layer, and dark currents of the photosensitive photodiode and the compensating photodiode are equal. According to the present invention, the dark current self-compensation function may be implemented at a chip level without an external circuit and an operational amplifier; the normal-incident photodiode structure according to the present invention has the photosensitive photodiode and the compensating photodiode, and the compensating photodiode may counteract the dark current of the photosensitive photodiode during operation, thus reducing noise caused by the dark current of the photosensitive photodiode; and bias voltages of the photosensitive photodiode and the compensating photodiode according to the present invention are controlled separately, and thus may be applied to more usage scenarios.

This light absorbing device includes: a light reflecting layer; a dielectric layer disposed on the light reflecting layer; and a plurality of metal nanostructures disposed on the dielectric layer. A portion of each of the plurality of metal nanostructures is buried in the dielectric layer and another portion thereof is exposed to the outside.

Thermophotovoltaic (TPV) systems and devices with improved efficiencies are disclosed herein. In one example, a thermophotovoltaic (TPV) cell includes an active layer; a back-surface reflective (BSR) layer; and a spacer layer positioned between the active layer and back-surface reflective layer.

According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.

A method of forming a sandwich passivation layer (405) on a semiconductor device (400) comprising a bond pad (404) is provided. The method comprises forming a first layer (406) over a surface of the semiconductor device (400), removing a part of the first layer (406) to expose a surface of the bond pad (404), forming a second layer (407) over the first layer (406) and the surface of the bond pad (404), and forming a third layer (408) over the second layer (407), wherein the surface of the bond pad (404) is not in contact with the first layer (406) or third layer (408).

A solid-state component responds to electromagnetic radiation and may be used as a photovoltaic element, as a photoelectric sensor, as a photocatalyst, or as a power store. The solid-state component has asymmetrical electrodes which face each other and are electron-conductively connected to each other by a semiconductor material and a coating in such a way that an open terminal voltage of 1.8 volts or even more is achieved by acting electromagnetic radiation.

Described herein are devices and methods that utilize three-dimensional topological semimetals (including Dirac, Weyl and nodal line) that may be useful in advanced electronic devices. The Fermi level in three dimensional topological semimetals can be significantly shifted in energy when forming a heterojunction with a semiconductor or metal. This has unintended and sometimes negative consequences for device performance. Described herein are designs and methods to modify the heterostructures to either suppress Fermi level movement or to produce an intentional shift to allow for the use of these improved semimetal devices.

The disclosure relates to the technical field of solar cells, and provides a solar cell and a doped region structure thereof, a cell assembly, and a photovoltaic system. The doped region structure includes a first doped layer, a passivation layer, and a second doped layer that are disposed on a silicon substrate in sequence. The passivation layer is a porous structure having the first doped layer and/or the second doped layer inlaid in a hole region. The first doped layer and the second doped layer have a same doping polarity. By means of the doped region structure of the solar cell provided in the disclosure, the difficulty in production and the limitation on conversion efficiency as a result of precise requirements for the accuracy of a thickness of a conventional tunneling layer are resolved.